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浏览/检索结果: 共4条，第1-4条 帮助 限定条件 专题：西安交通大学    第一署名单位    第一作者单位    通讯作者单位     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Effects of mold geometries and initial thickness on resist filling characteristics in UV-NIL 期刊论文 Zhejiang Daxue Xuebao (Gongxue Ban)/Journal of Zhejiang University (Engineering Science), 2012, 卷号: 46, 期号: [db:dc_citation_issue], 页码: 1175-1181 作者:  Du, Jun;  Wei, Zheng-Ying;  Xiong, Xiao-Dong;  He, Wei;  Tang, Yi-Ping 收藏  |  浏览/下载：1/0  |  提交时间：2019/12/10 Cross sectional profiles  Duty ratios  Filling process  Filling properties  Influence rule  Initial thickness  Nonlinear characteristics  Thickness-to-width ratio   Effects of Mold Geometries and Initial Resist Thickness on Filling Behavior in UV-Nanoimprint Lithography 期刊论文 JOURNAL OF COMPUTATIONAL AND THEORETICAL NANOSCIENCE, 2012, 卷号: 9, 期号: [db:dc_citation_issue], 页码: 1029-1035 作者:  Du, Jun;  Wei, Zhengying;  He, Wei;  Tang, Yiping 收藏  |  浏览/下载：3/0  |  提交时间：2019/12/10 Filling Mode  Nanoimprint Lithography  Initial Resist Thickness  Filling Behavior  Duty Ratio   Analysis of resist's flow behavior during micro imprinting 期刊论文 Zhongguo Jixie Gongcheng/China Mechanical Engineering, 2010, 卷号: 21, 期号: [db:dc_citation_issue] 作者:  Wen, Juying;  Wei, Zhengying;  Xiong, Xiaodong;  Du, Jun;  Lu, Bingheng 收藏  |  浏览/下载：3/0  |  提交时间：2019/12/10 Flow behavior  Micro imprinting  Mold duty ratio  Single-dual peak  Width/thickness ratio   Flow behavior of resist in room-temperature micro-imprinting and its process optimization 期刊论文 Guangxue Jingmi Gongcheng/Optics and Precision Engineering, 2010, 卷号: 18, 期号: [db:dc_citation_issue], 页码: 1822-1832 作者:  Wei, Zheng-Ying;  Xiong, Xiao-Dong;  Du, Jun;  Ding, Yu-Cheng 收藏  |  浏览/下载：2/0  |  提交时间：2019/12/10 Duty ratios  Filling rate  Fluid solid interaction  Imprinting process  Residual thickness  Room-temperature micro-imprinting  Technological conditions  Visual experiments