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| Size Effects in the Oriented-Attachment Growth Process: The Case of Cu Nanoseeds 期刊论文 2010, 2010 Shen, Shuling; Zhuang, Jing; Xu, Xiangxing; Nisar, Amjad; Hu, Shi; Wang, Xun
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| Recent development of electronic packaging technology 期刊论文 2010, 2010 Fu Yuepeng; Tan Kai; Tian Minbo
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| 电子封装技术的最新进展 期刊论文 2010, 2010 傅岳鹏; 谭凯; 田民波; Fu Yuepeng; Tan Kai; Tian Minbo
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| 多层介质格林函数法求解导电衬底上的三维电容 期刊论文 2010, 2010 李成; 张文俊; 余志平; LI Cheng; ZHANG Wen-jun; YU Zhi-ping
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| 采用统一建模的拥挤度驱动三维芯片布局算法 期刊论文 2010, 2010 闫海霞; 周强; 洪先龙; Yan Haixia; Zhou Qiang; Hong Xianlong
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| Gray-tone lithography for micro opto-device of arbitrary 3D shaped surfaces 期刊论文 2010, 2010 Shi Jun-Feng; Zhang Guang-Guo; Wang Dong-Sheng
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| Metal microstructure microfabrication technique 期刊论文 2010, 2010 Wu Ying; Zhou Zhao-ying; Jing Yong-qing; Xiang Yi; Takahito Ono
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| Multi-layered Green function approach to 3D capacitance extraction with substrate loss 期刊论文 2010, 2010 Li Cheng; Zhang Wen-jun; Yu Zhi-ping
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| Electro-thermal simulation of integrated circuits using finite difference method 期刊论文 2010, 2010 Wang Nai-Long; Liu Miao; Zhou Run-de
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| A kinetically controlled trans bifunctionalized organoimido derivative of the Lindqvist-type hexamolybdate: Synthesis, spectroscopic characterization, and crystal structure of (n-Bu4N)(2){trans-[Mo6O17(NAr)(2)]} (Ar=2,6-dimethylphenyl) 期刊论文 2010, 2010 Xia, Y; Wei, YG; Wang, Y; Guo, HY
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