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Thermal energy storage and transfer of Phase Change Composites based on Graphite Foam encapsulated Polyurethane 其他
2013-01-01
Renjie Chen; Zhenpu Liu; Yinxia Wang; Jianhua Lin; Ruqiang Zou
收藏  |  浏览/下载:2/0  |  提交时间:2017/12/03
Generalized Thermal Design Model for Comb-Capacitor MEMS Devices Fabricated by Bonding-DRIE Process: A Preliminary Framework 其他
2013-01-01
Sun, Han; Yang, Fang; Wang, Wei; Zhang, Dacheng
收藏  |  浏览/下载:3/0  |  提交时间:2015/11/13
THE INVESTIGATION OF 3D EMBEDDED MICROCHANNEL NETWORKS FOR 3D IC COOLING, VACUUM PACKAGING AND THZ PASSIVE DEVICE APPLICATIONS 其他
2012-01-01
Miao, Min; Zhang, Jing; Zhang, Yang; Han, Bo; Jin, Yufeng
收藏  |  浏览/下载:4/0  |  提交时间:2015/11/16
Numerical Investigation of the Evolution of the Heat Partition Factor During Bolt Tightening 其他
2011-01-01
Zhu, Xuwen; Guessous, Laila; Barber, Gary C.
收藏  |  浏览/下载:4/0  |  提交时间:2015/11/10
Development of an efficient thermal transfer structure in rapid heat cycle molding 其他
2011-01-01
Fan Zengwei; Ge Xiaohong; Huang Hongwu; Li Hui; 葛晓宏
收藏  |  浏览/下载:5/0  |  提交时间:2015/07/22
Study the heat transfer process from electron-phonon nonequilibrium in thin gold film to glass substrate through transient thermoreflectance measurements 其他
2010-01-01
Ma, Weigang; Wang, Haidong; Zhang, Xing; Wang, Wei
收藏  |  浏览/下载:7/0  |  提交时间:2015/11/13
Phononics: A new science and technology of controlling heat flow and processing information by phonons 其他
2010-01-01
Wang, Lei; Zhang, Gang; Wu, Gang; Yang, Nuo; Li, Baowen
收藏  |  浏览/下载:5/0  |  提交时间:2015/11/13
The investigation of 3D embedded microchannel networks for 3D IC cooling, vacuum packaging and thz passive device applications 其他
2010-01-01
Miao, Min; Zhang, Jing; Zhang, Yang; Han, Bo; Jin, Yufeng
收藏  |  浏览/下载:13/0  |  提交时间:2015/11/13
NaGdF_4:Eu~(3+)的结构和VUV荧光性质 其他
2001-01-01
由芳田; 王颖霞; 林建华; 陶冶
收藏  |  浏览/下载:3/0  |  提交时间:2015/10/24


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