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浏览/检索结果: 共6条，第1-6条 帮助 限定条件 内容类型：其他     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 A Wafer Level Through-Stack-Via Integration Process with One-time Bottom-up Copper Filling 其他 2014-01-01 Zhu, Yunhui; Ma, Shenglin; Sun, Xin; Fang, Runiu; Zhong, Xiao; Bian, Yuan; Guan, Yong; Chen, Jing; Miao, Min; Jin, Yufeng 收藏  |  浏览/下载：2/0  |  提交时间：2017/12/03 INTERCONNECTS   3D ICE printing as a fabrication technology of microfluidics with pre-sealed reagents 其他 2014-01-01 Zhang, Hongze; Li, Hui; Wu, Mengxi; Yu, Huaiqiang; Wang, Wei; Li, Zhihong 收藏  |  浏览/下载：3/0  |  提交时间：2015/11/13 Diode characteristic of electrolyte-oxide-semiconductor structure for potential chemical and biological applications 其他 2011-01-01 Zhang, Y.L.; Sun, G.C.; Wu, W.G. 收藏  |  浏览/下载：4/0  |  提交时间：2015/11/13 Bottom-Up Fabrication of Special Parylene Films Based on Selective Growth on Au-coated Surface 其他 2009-01-01 Zhou, Yi; Ding, Fei; Ni, Chao; Wang, Wei; Wu, Wengang 收藏  |  浏览/下载：1/0  |  提交时间：2015/11/10 hydrophilicity  parylene  selective growth  roughness  CHEMICAL-VAPOR-DEPOSITION   Research on Deep RIE-based Through-Si-Via Micromachining for 3-D System-in-package Integration 其他 2009-01-01 Miao, Min; Jin, Yufeng; Liao, Hongguang; Zhao, Liwei; Zhu, Yunhui; Sun, Xin; Guo, Yunxia 收藏  |  浏览/下载：5/0  |  提交时间：2015/11/12 Bulk Micromachining  Deep Reactive Ion Etching (DRIE)  Through-Si-Via (TSV)  System-in-package(Sip)  Three dimensional integration   Deterministic algorithm for the reordering problem using tile assembly 其他 2009-01-01 Huang, Yufang; Xu, Jin; Cheng, Zhen; Chen, Zhihua; Zhang, Xuncai 收藏  |  浏览/下载：3/0  |  提交时间：2015/11/12