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浏览/检索结果: 共8条，第1-8条 帮助 限定条件 内容类型：其他    专题：北京大学    第一署名单位    第一作者单位    通讯作者单位     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Simulation and evaluation of thermal mechanical reliability of 3D-TSV stack with viscoelastic underfill 其他 2016-01-01 Zeng, Qinghua; Guan, Yong; Su, Fei; Chen, Jing; Jin, Yufeng 收藏  |  浏览/下载：6/0  |  提交时间：2017/12/03 Fabrication and Characterization of Low Stress Si Interposer with Air-gapped Si Interconnection for Hermetical System-in-Package 其他 2016-01-01 Luo, Rongfeng; Ren, Kuili; Ma, Shenglin; Yan, Jun; Xia, Yanming; Jin, Yufeng; Chen, Jing; Wu, Tianzhun; Yang, Hangao; Yuan, Lifang 收藏  |  浏览/下载：5/0  |  提交时间：2017/12/03 Air-gapped Si  Si interposer  low stress  hermetical  System-in-Package  MEMS  WAFER-LEVEL  MEMS RESONATORS  TSV INTERPOSERS  VACUUM  MEMBRANES  DEVICES  SENSORS   A method to evaluate the influence of different substrate on stress mismatch induced deformation in MEMS accelerometer 其他 2015-01-01 You, Jun; Tian, Dayu; He, Chunhua; Zhao, Qiancheng; Yang, Zhenchuan; Zhang, Dacheng; Yan, Guizhen 收藏  |  浏览/下载：8/0  |  提交时间：2017/12/03 A Method to Evaluate the Influence of Different Substrate on Stress Mismatch Induced Deformation in MEMS Accelerometer 其他 2015-01-01 You, Jun; Tian, Dayu; He, Chunhua; Zhao, Qiancheng; Yang, Zhenchuan; Zhang, Dacheng; Yan, Guizhen 收藏  |  浏览/下载：6/0  |  提交时间：2017/12/03 thermal reliability  temperature drift  deformation  capacitance variation  packaging  structural design   Simulation and Evaluation of Thermal Mechanical Reliability of 3D-TSV Stack with Viscoelastic Underfill 其他 2015-01-01 Zeng, Qinghua; Guan, Yong; Su, Fei; Chen, Jing; Jin, Yufeng 收藏  |  浏览/下载：4/0  |  提交时间：2017/12/03 Tectonics of the northern Himalaya since the India-Asia collision 其他 2012-01-01 Zhang, Jinjiang; Santosh, M.; Wang, Xiaoxian; Guo, Lei; Yang, Xiongying; Zhang, Bo 收藏  |  浏览/下载：4/0  |  提交时间：2015/11/10 Northern Himalaya  Orogenic process  Tectonic transform  India-Asia collision  SOUTH TIBETAN DETACHMENT  EAST-WEST EXTENSION  EFFECTIVE MOMENT CRITERION  OROGEN-PARALLEL EXTENSION  ANGLE NORMAL FAULTS  SHEAR ZONE  GEOLOGICAL IMPLICATIONS  CONTINENTAL COLLISION  TERTIARY DEFORMATION  STRUCTURAL EVOLUTION   The fatigue failure analysis of 3D SiP with Through Silicon Via 其他 2011-01-01 Kang, Wenping; He, Yang; Zhu, Zhiyuan; Miao, Min; Chen, Jing; Jin, Yufeng 收藏  |  浏览/下载：4/0  |  提交时间：2015/11/16 Design and analysis of a bulk micromachined distributed digital microwave phase shifter on glass substrate 其他 2007-01-01 Miao, Min; Jin, Yufeng; Wu, Guoying; Hao, Yilong 收藏  |  浏览/下载：3/0  |  提交时间：2015/11/17