CORC

浏览/检索结果: 共27条,第1-10条 帮助

限定条件    
已选(0)清除 条数/页:   排序方式:
Evolution of copper species on Cu/SAPO-34 SCR catalysts upon hydrothermal aging (CPCI-S收录) 会议
作者:  Liu, Xuesong[1,2];  Wu, Xiaodong[1];  Weng, Duan[1,2];  Si, Zhichun[2];  Ran, Rui[1]
收藏  |  浏览/下载:2/0  |  提交时间:2019/04/11
H2/O2 alkaline membrane fuel cell performances using carbon-supported metal phthalocyanine (MPc/C,M = Co, Cu, Zn, Ni) as cathode catalysts (EI收录) 会议
Chicago, IL, United states,
作者:  Zhu, Taishan[1];  Qing, Xin[1];  Xu, Pan[1];  Song, Yanxi[1];  Qiao, Jinli[1]
收藏  |  浏览/下载:8/0  |  提交时间:2019/04/11
The influence of velocity variation on the adhesive contact behavior and the deformation of substrate based on molecular dynamics method (EI收录) 会议
Nantou, Taiwan,
作者:  Chen, Jingjing[1];  Huang, Jianmeng[1];  Liu, Yang[2];  Gao, Shengfu[3];  Li, Ning[4]
收藏  |  浏览/下载:8/0  |  提交时间:2019/04/11
Stretchable Copper Wires based on Reduction of Active Metallic Nanoparticles and Electroplating (CPCI-S收录) 会议
作者:  Zou, Peichao[1];  Liu, Jingping[1];  Yang, Cheng[1]
收藏  |  浏览/下载:0/0  |  提交时间:2019/04/11
Research on Improvement of TiAlN Coating on Tribological properties of Miniature Inner Grooved Copper Tubes Drawing Mold Materials (CPCI-S收录) 会议
作者:  Ma, Bo[1];  Liu, Bin[1];  Yuan, Wei[1];  Li, Zongtao[1];  Li, Fuqiu[2]
收藏  |  浏览/下载:4/0  |  提交时间:2019/04/11
Performance analysis of pre-oxidation process direct bonding copper substrate (CPCI-S收录) 会议
作者:  Ning, Honglong[1,2,5];  Hu, Shiben[1,2];  Tao, Ruiqiang[1,2];  Liu, Xianzhe[1,2];  Zeng, Yong[1,2]
收藏  |  浏览/下载:1/0  |  提交时间:2019/04/11
Effect of Copper Oxide on Fast Pyrolysis of Enzymatic/mild Acidolysis Lignin (EI收录) 会议
Beijing, China,
作者:  Cheng, Hao[1];  Wu, Shubin[1]
收藏  |  浏览/下载:1/0  |  提交时间:2019/04/11
An artificial panel produced by sorting residue of copper clad laminate (CPCI-S收录) 会议
作者:  Chen, Yanzhi[1];  Wang, Wei[1];  Zhong, Mingfeng[2];  Wen, Yong[1];  Liu, Xiaowen[1]
收藏  |  浏览/下载:2/0  |  提交时间:2019/04/11
Design and Manufacture of the Inner Hole Dresser of Surface Grinder's Main Shaft Sleeve (CPCI-S收录) 会议
作者:  Qian, Canrong[1];  Qian, Yuanzhi[2]
收藏  |  浏览/下载:3/0  |  提交时间:2019/04/11
Research on thermal-electric coupling effect of the Copper Pillar Bump in the Flip Chip Packaging (CPCI-S收录) 会议
作者:  Fu Zhiwei[1,2];  Zhou Bin[1,2];  Yao Ruohe[1];  Li Xunping[2]
收藏  |  浏览/下载:2/0  |  提交时间:2019/04/11


©版权所有 ©2017 CSpace - Powered by CSpace