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会议论文 [17]
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A design and qualification of LED flip Chip-on-Board module with tunable color temperatures
会议论文
MICROELECTRONICS RELIABILITY, 2018-05-01
作者:
Fan, Jiajie
;
Cao, Jianwu
;
Yu, Chaohua
;
Qian, Cheng
;
Fan, Xuejun
收藏
  |  
浏览/下载:5/0
  |  
提交时间:2019/12/30
LED
Wafer level chip scale package
Chip-on-Board
Tunable color temperatures
Luminous flux modeling
Drop Failure Modes of A Wafer-Level Chip-Scale Packaging
会议论文
14th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Dalian, PEOPLES R CHINA, 2013-08-11
作者:
Huang, Mingliang
;
Liu, Shuang
;
Zhao, Ning
;
Long, Haohui
;
Li, Jianhui
收藏
  |  
浏览/下载:4/0
  |  
提交时间:2019/12/11
Sn-3Ag-0.5Cu solder joint
board-level drop reliability
failure mode
wafer-level chip-scale packaging (WLCSP)
intermetallic compound (IMC)
Fully automatic wafer-scale micro/nano manipulation based on optically induced dielectrophoresis
会议论文
2nd International Conference on Advances in Materials and Manufacturing Processes, ICAMMP 2011, Guilin, China, December 16-18, 2011
作者:
Qu YL(曲艳丽)
;
Zheng MJ(郑美娟)
;
Liang WF(梁文峰)
;
Dong ZL(董再励)
收藏
  |  
浏览/下载:27/0
  |  
提交时间:2012/10/24
Amorphous silicon
Electric fields
Electrophoresis
Fabrication
Innovation
Nanosensors
Polystyrenes
Silicon wafers
Information extraction from laser speckle patterns using wavelet entropy techniques (EI CONFERENCE)
会议论文
MIPPR 2011: Multispectral Image Acquisition, Processing, and Analysis, November 4, 2011 - November 6, 2011, Guilin, China
Wang X.-J.
;
Li X.-Z.
;
Su S.-C.
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  |  
浏览/下载:25/0
  |  
提交时间:2013/03/25
A novel speckle patterns processing method is presented using multi-scale wavelet techniques. Laser speckle patterns generated from the sample contained abundant information. In this paper
we propose a method using wavelet entropy techniques to analyze the speckle patterns and exact the information on the sample surface. In our case
we used this approach to test the solar silicon cell surface profiles based on the sym8 orthogonal wavelet family. According different wavelet entropy values
the micro-structure of different solar silicon cell surfaces were comparative analyzed. Furthermore
we studied the AFM and reflective spectra of the wafer. Results show that the wavelet entropy speckle processing method is effective and accurate. And the experiment proved that this method is a useful tool to investigate the surface profile quality. 2011 SPIE.
化学机械抛光中的纳米级薄膜流动
会议论文
中国微米、纳米技术第七届学术会年会论文集(二), 中国微米、纳米技术第七届学术会年会, 中国大连, CNKI, 中国机械工程学会
张朝辉
;
雒建斌
;
雷红
;
Zhang Chaohui
;
Luo Jianbin
;
Lei Hong
收藏
  |  
浏览/下载:3/0
Characteristics of nucleation and bubble growth during microscale boiling
会议论文
HT2005: Proceedings of the ASME Summer Heat Transfer Conference 2005, Vol 2, ASME Heat Transfer Summer Conference, San Francisco, CA, Web of Science
Tian, Yong
;
Liu, Jiang-Tao
;
Peng, Xiao-Feng
收藏
  |  
浏览/下载:3/0
Modeling and simulation of piezoelectric MEMS energy harvesting device
会议论文
Integrated Ferroelectrics, Nineteenth International Symposium of Integrated Ferroelectrics, Bordeaux, France, INSPEC
Lin, J.H.
;
Wu, X.M.
;
Ren, T.L.
;
Liu, L.T.
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  |  
浏览/下载:3/0
Focusing and leveling in dual stage lithographic system
会议论文
Proceedings of the SPIE - The International Society for Optical Engineering, 2010
作者:
Jinlong Li
;
Lixin Zhao
;
Song Hu
;
Shaolin Zhou
收藏
  |  
浏览/下载:14/0
  |  
提交时间:2016/11/24
Research on focusing technique based on dual-phase lock-in amplifier in 193nm lithography system
会议论文
Proceedings of the SPIE - The International Society for Optical Engineering, 2010
作者:
Fei Xie
;
Xiaoping Tang
;
Song Hu
;
Wei Yan
收藏
  |  
浏览/下载:9/0
  |  
提交时间:2016/11/24
Test Architecture Design and Optimization for Three-Dimensional SoCs
会议论文
2009 Design, Automation and Test in Europe Conference and Exhibition, DATE '09
作者:
Li Jiang
;
Lin Huang
;
Qiang Xu
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  |  
浏览/下载:7/0
  |  
提交时间:2015/08/21
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