CORC

在结果中检索

CORC

浏览/检索结果: 共71条，第1-10条 帮助

限定条件    
已选(0)清除 条数/页：   排序方式：
Effects of electromigration on microstructural evolution and mechanical properties of preferential growth intermetallic compound interconnects for 3D packaging 会议论文
69th IEEE Electronic Components and Technology Conference, ECTC 2019, Las Vegas, NV, United states, 2019-05-28
作者:  Huang, Mingliang L.;  Zou, Lin
收藏  |  浏览/下载：9/0  |  提交时间：2019/12/02
Electromigration behavior and mechanical properties of the whole preferred orientation intermetallic compound interconnects for 3D packaging 会议论文
The 68th Electronic Components and Technology Conference
作者:  Huang ML(黄明亮);  Zou L(邹林);  Yin SQ(尹斯奇)
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/02
Growth mechanism of Cu3Sn grains in the (111)Cu/Sn/Cu micro interconnects 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Zhong, Yi;  Zhao, Ning;  Dong, Wei;  Wang, Yunpeng;  Ma, Haitao
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/02
Effect of Temperature Gradient on Interfacial Reactions in Cu/Sn-9Zn/Ni Solder Joints during Aging 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Zhao, Ning;  Wang, Mingyao;  Zhong, Yi;  Ma, Haitao;  Wang, Yunpeng
收藏  |  浏览/下载：19/0  |  提交时间：2019/12/02
Size Effect of Interfacial Reaction in Sn-0.7Cu/Cu solder under Multiple Reflow 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Huang, Ru;  Xia, Mengrou;  Yao, Jinye;  Wang, Boyin;  Qi, Xiao
收藏  |  浏览/下载：6/0  |  提交时间：2019/12/02
Electromigration behavior and mechanical properties of the whole preferred orientation intermetallic compound interconnects for 3D packaging 会议论文
68th IEEE Electronic Components and Technology Conference, ECTC 2018, San Diego, CA, United states, 2018-05-29
作者:  Huang, M.L.;  Zou, L.;  Yin, S.Q.
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/02
Ultrasound-assisted soldering of Cu alloy using a Ni-foam reinforced Sn composite solder 会议论文
18th International Conference on Electronic Packaging Technology (ICEPT), IEEE, Harbin, PEOPLES R CHINA, AUG 16-19, 2017
作者:  Wang, Qiwei;  Xiao, Yong*;  Zhang, Xingyi
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/04
Study on interfacial reactions in Cu/Sn-9Zn/Ni micro solder joints under temperature gradient 会议论文
2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017-01-01
作者:  Zhao, Ning;  Wang, Mingyao;  Zhong, Yi;  Ma, Haitao;  Wang, Yunpeng
收藏  |  浏览/下载：10/0  |  提交时间：2019/12/03
Effect of intermetallic compound thickness on tensile behavior of Cu/Sn/Cu micro interconnects 会议论文
2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017-01-01
作者:  Kuang, Jiameng;  Yang, Fan;  Huang, Mingliang
收藏  |  浏览/下载：9/0  |  提交时间：2019/12/03
Low temperature Ni/Sn/Ni transient liquid phase bonding for high temperature packaging applications by imposing temperature gradient 会议论文
2017 IEEE 67TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2017), 2017-01-01
作者:  Zhong, Y.;  Zhao, N.;  Ma, H. T.;  Dong, W.;  Huang, M. L.
收藏  |  浏览/下载：5/0  |  提交时间：2019/12/09

©版权所有 ©2017 CSpace - Powered by CSpace