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Debris-flow deposition: Effects of fluid viscosity and grain size 会议论文
Golden, CO, June 10, 2019 - June 13, 2019
作者:  Li, Shuai;  Zhou, Gordon G.D.;  Chen, Xiaoqing;  Song, Dongri
收藏  |  浏览/下载：22/0  |  提交时间：2020/03/10
Effects of Laser Welding Parameters on the Characteristics of Deposition Layer 会议论文
作者:  Su, Guoxing;  Shi, Yu;  Zhang, Gang;  Xie, Jinlong
收藏  |  浏览/下载：14/0  |  提交时间：2019/11/15
Hydrodynamic response of solid target heated by heavy ion beams from future facility HIAF 会议论文
作者:  Ren, Jieru;  Xiao, Guoqing;  Xu, Zhongfeng;  Cheng, Rui;  Zhao, Yongtao
收藏  |  浏览/下载：28/0  |  提交时间：2018/08/20
Hydrodynamic response of solid target heated by heavy ion beams from future facility HIAF 会议论文
作者:  Cheng, Rui;  Zhao, Yongtao;  Xiao, Guoqing;  Xu, Zhongfeng;  Ren, Jieru
收藏  |  浏览/下载：17/0  |  提交时间：2018/08/20
A Brief Overview of Atomic Layer Deposition and Etching in the Semiconductor Processing 会议论文
17th International Conference on Electronic Packaging Technology (ICEPT), 2016-08-16
作者:  Yuan, Guangjie[1];  Wang, Ning[2];  Huang, Shirong[3];  Liu, Johan[4]
收藏  |  浏览/下载：5/0  |  提交时间：2019/04/26
A constitutive model considering friction property of geomaterials and stability analysis of borehole 会议论文
Wuhan, PEOPLES R CHINA, SEP 06-08, 2015
作者:  Zheng, Ying-ren;  Gao, Hong;  Feng, Xia-ting;  Jiang, Quan;  Zhang, Yong-hui
收藏  |  浏览/下载：20/0  |  提交时间：2018/06/05
Breaking behavior of oxide scale on the LPPS bond coat surface during pre- treatment in vacuum 会议论文
作者:  Zhang, Bang-Yan;  Yang, Guan-Jun;  Li, Cheng-Xin;  Li, Chang-Jiu
收藏  |  浏览/下载：6/0  |  提交时间：2019/12/02
Columnar structured YSZ coating formation by PS-PVD using conventional plasma spray system assisted through droplet filtering 会议论文
作者:  Chen, Qing-Yu;  Li, Cheng-Xin;  Li, Chang-Jiu;  Luo, Xiao-Tao;  Yang, Guan-Jun
收藏  |  浏览/下载：7/0  |  提交时间：2019/12/02
Unravelling Orientation Distribution and Merging Behavior of Monolayer Mo S2 Domains on Sapphire 会议论文
Qingqing Ji; Yanfeng Zhang; Zhongfan Liu
收藏  |  浏览/下载：3/0  |  提交时间：2017/12/03
O2 plasma treatment in polymer insulation process for through silicon vias 会议论文
Proceedings of the Electronic Packaging Technology Conference, EPTC,, 中国
作者:  Zhuang, Lulu;  Jiang, Kun;  Zhang, Guoping;  Tang, Jiaoning;  Sun, Rong
收藏  |  浏览/下载：17/0  |  提交时间：2015/09/01

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