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| Fastening torque simulation method of pressure-ring based on finite element simulation analysis and experimental verification 会议论文
Shanghai, China, 2021-10-28
作者: Zhao, Yue; Kang, Shifa; Fu, Xihong; Zhang, Gaopeng
  收藏 | 浏览/下载：71/0 | 提交时间：2022/03/18
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| Study on adhesive curing process and bonding property of XM-31 silicone rubber 会议论文
Shanghai, China, 2021-10-28
作者: Zheng, Xiangke; Wang, Peng; Kang, Shifa; Duan, Zhanjun; Jia, Xin
收藏 | 浏览/下载：81/0 | 提交时间：2022/03/18
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| Design and analysis of bonding process of the space-based rectangular curved prisms 会议论文
Shanghai, China, 2021-10-28
作者: Jia, Xinyin; Wang, Feicheng; Ke, Shanliang; Hu, Bingliang; Li, Libo
收藏 | 浏览/下载：40/0 | 提交时间：2022/03/18
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| Research progress and core technologies of optical-mechanical system based on additive manufacturing 会议论文
Beijing, China, 2021-06-20
作者: Jia, Xinyin; Hu, Bingliang; Wang, Feicheng; Li, Siyuan; Sun, Lijun
收藏 | 浏览/下载：34/0 | 提交时间：2022/01/30
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| Preparation and characterization of the double-side adhesive tape with reactive properties and high thermal conductivity for electronic packaging 会议论文
上海, 2018
作者: Chang Hao; Zhang Baotan; Sun Rong
收藏 | 浏览/下载：30/0 | 提交时间：2019/01/31 |
| Preparation and characterization of the double-side adhesive tape with reactive properties and high thermal conductivity for electronic package 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
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收藏 | 浏览/下载：8/0 | 提交时间：2020/01/03
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| Ethylene Vinyl Acetate Copolymer-Based High-Adhesion, Low-Cost and Superlyophobic Dry Adhesives 会议论文
Singapore, 2017
作者: L. Yuan; T. Peng; Z. Wang; T. Wu
收藏 | 浏览/下载：16/0 | 提交时间：2018/02/02 |
| Thermally Reversible and Crosslinked Polyurethane based on Diels-Alder Chemistry for Ultrathin Wafer Temporary Bonding at Low-temperature 会议论文
Orlando，the USA
作者: Jinhui Li; Qiang Liu; Guoping Zhang; Bin Zhao; Rong Sun
收藏 | 浏览/下载：21/0 | 提交时间：2018/02/02 |
| Effect of ion etching on the surface morphology, structure and adhesive strength of the TiN coating. 会议论文
MSEE2016, 四川成都
作者: Hai-Li Zhu; Chun-lei Jiang; Kyunsoo Shin; Tao Wang; Guang-hai Chen
收藏 | 浏览/下载：16/0 | 提交时间：2017/01/15 |
| Preparation of highly conductive adhesives by in-stiu incorporation of silver nanoparticles 会议论文
The 17th International Conference on electronic packing Technology (ICEPT 2016), Changsha,China
作者: Yankang Han; Baotan Zhang; Pengli Zhu; Shulei Huang; Qianqian Liu
收藏 | 浏览/下载：32/0 | 提交时间：2017/01/15 |
