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Stress analysis and design of the waveguide bellows for EAST ECRH system 会议论文
Hangzhou, China, June 21-22, 2020
作者:  Zhang, Lingyuan;  Wang, Xiaojie;  Liu, Fukun;  Xu, Handong;  Wu, Dajun
收藏  |  浏览/下载：49/0  |  提交时间：2020/10/22
Evolution of the mechanical properties of a cobalt-based alloy under thermal shocks 会议论文
作者:  Wen, Junxia;  Che, Hongyan;  Cao, Rui;  Dong, Hao;  Ye, Youxiong
收藏  |  浏览/下载：2/0  |  提交时间：2020/12/18
Design and Test of Flexible Support Structure for Large Aperture Lightweight Mirror 会议论文
Beijing, PEOPLES R CHINA, 2020-11-30
作者:  Sun Li Jun;  Liu Zhen;  Zhang Zhao Hui;  Li Li Bo;  Li Si Yuan
收藏  |  浏览/下载：31/0  |  提交时间：2021/06/04
The research progress on strengthen property and mechanism of warm laser shock peening 会议论文
Shanghai, China, October 17-20, 2020
作者:  Yang YQ(杨玉奇);  Zhao JB(赵吉宾);  Qiao HC(乔红超);  Wu JJ(吴嘉俊);  Hu XL(胡宪亮)
收藏  |  浏览/下载：5/0  |  提交时间：2021/01/17
Design of C Band High Power Teflon Water Load 会议论文
武汉, 2019-11-9
作者:  Dingzhen Li;  Lianmin Zhao;  Fukun Liu
收藏  |  浏览/下载：8/0  |  提交时间：2020/10/23
Development of High Power Annular Diode Laser Array Using Hard Solder 会议论文
San Francisco, CA, 2019-02-04
作者:  Hou, Dong;  Sun, Lichen;  Fu, Tuanwei;  Chen, Li;  Liang, Xuejie
收藏  |  浏览/下载：53/0  |  提交时间：2019/06/28
Experimental and theoretical analysis of the effect of packaging induced thermal stress on high-power laser diode arrays 会议论文
San Francisco, CA, United states, 2019-02-03
作者:  Zhang, Hongyou;  Zah, Chung-En;  Liu, Xingsheng
收藏  |  浏览/下载：38/0  |  提交时间：2019/07/08
Experimental studies on gas production rate of in-situ hydratebearing clay in thermal recovery and depressurization methods 会议论文
INNOVATIVE SOLUTIONS FOR ENERGY TRANSITIONS, 2019-01-01
作者:  Luo, Tingting;  Li, Yanghui;  Liu, Weiguo;  Song, Yongchen
收藏  |  浏览/下载：20/0  |  提交时间：2019/12/02
Design of SiC mirror subsystem of a space-based astronomy telescope 会议论文
Chengdu, China, 2018-06-26
作者:  Feng, Liang-Jie;  Ding, Jiao-Teng;  Zou, Gang-Yi
收藏  |  浏览/下载：29/0  |  提交时间：2019/03/22
Effect of thermal stress on the electrical properties of TSV inductor 会议论文
2019 IEEE INTERNATIONAL CONFERENCE ON ELECTRON DEVICES AND SOLID-STATE CIRCUITS (EDSSC), 2019-01-01
作者:  Wang, Fengjuan;  Liu, Jingting;  Yu, Ningmei
收藏  |  浏览/下载：11/0  |  提交时间：2019/12/20

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