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Improved Thermal Conductive Property of Pine Needle Derived Carbon for Thermal Management Applications 会议论文
20th International Conference on Electronic Materials and Packaging, EMAP 2018, Clear Water Bay, Hong kong, 2018-12-17
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收藏  |  浏览/下载：3/0  |  提交时间：2020/01/03
Preparation and Characterization of Al2O3-AgNP hybrids for Application in Thermally Conductive Polymer Composites 会议论文
上海, 2018
作者:  Linlin Ren;  Xiaoliang Zeng;  Rong Sun;  Jianbin Xu;  Ching-Ping Wong
收藏  |  浏览/下载：24/0  |  提交时间：2019/01/31
Metal-Organic Framework Derived PdCu/C as an Efficient Catalyst for Electroless Copper Deposition 会议论文
上海, 2018
作者:  Jiahui Chen;  Huangqing Ye;  Jinqi Xie;  Changzeng Yan;  Rong Sun
收藏  |  浏览/下载：26/0  |  提交时间：2019/01/31
A novel graphene oxide millisphere / epoxy resin composite with Enhanced Thermal Conductivit 会议论文
上海, 2018
作者:  Chen Li;  Xiaoliang Zeng;  Deliang Zhu;  Rong Sun;  Jianbin Xu
收藏  |  浏览/下载：27/0  |  提交时间：2019/01/31
Improved Thermal Conductive Property of Pine Needle Derived Carbon for Thermal Management Applications 会议论文
2018 20TH INTERNATIONAL CONFERENCE ON ELECTRONIC MATERIALS AND PACKAGING (EMAP), 2018-01-01
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收藏  |  浏览/下载：4/0  |  提交时间：2020/01/03
Optimization Analysis of Thermal Management System for Electric Vehicle Battery Pack 会议论文
ADVANCES IN MATERIALS, MACHINERY, ELECTRONICS II, 2018-01-01
作者:  Gong, Huiqi;  Zheng, Minxin;  Jin, Peng;  Feng, Dong
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/30
A Novel Organic Substrate with Enhanced Thermal Conductivity 会议论文
Orlando，the USA
作者:  Xiaoliang Zeng;  Yimin Yao;  Yougen Hu;  Kun Guo;  Jiajia Sun
收藏  |  浏览/下载：21/0  |  提交时间：2018/02/02
Multidisciplinary design optimization of air-based battery thermal management system in electric vehicles 会议论文
58th AIAA/ASCE/AHS/ASC Structures, Structural Dynamics, and Materials Conference, 2017, Grapevine, TX, United states, 2017-01-09
作者:  Li, Mao;  Wang, Xiaobang;  Liu, Yuanzhi;  Zou, Ziyan;  Cui, Mingjian
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/03
Fabrication and Characterization of a Carbon Fiber Solder Composite Thermal Interface Material 会议论文
2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01
作者:  Hansson, Josef[1];  Ye, Lilei[2];  Liu, Johan[3]
收藏  |  浏览/下载：3/0  |  提交时间：2019/04/24
Current status and progress of organic functionalization of CNT based thermal interface materials for electronics cooling applications 会议论文
2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01
作者:  Nylander, Andreas[1];  Fu, Yifeng[2];  Ye, Lilei[3];  Liu, Johan[4]
收藏  |  浏览/下载：27/0  |  提交时间：2019/04/24

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