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CORC

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Effect of Ag element on microstructure and mechanical properties of Sn-Bi-xAg solders designed by cluster-plus-glue-atom model 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Ren, Jing;  Huang, Mingliang;  Yang, Xudong
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/02
Synchrotron radiation in situ study on the solidification of Cu/Sn-58Bi/Cu solder joint under temperature gradient 会议论文
17th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Elect Mfg & Packaging Technol Soc, Wuhan, PEOPLES R CHINA, 2016-08-16
作者:  Zhao, Ning;  Zhong, Yi;  Huang, Mingliang;  Ma, Haitao;  Dong, Wei
收藏  |  浏览/下载：8/0  |  提交时间：2019/12/09
The comparative study on interfacial IMCs growth of three Cu/SnAgCu/Cu solder joints with Bi and Cr additions during thermal aging 会议论文
2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2012), 2012-08-13
作者:  Ju, Guokui[1];  Bi, Wenzhen[2];  Lin, Fei[3];  Han, Yongjiu[4];  Wei, Xicheng[5]
收藏  |  浏览/下载：6/0  |  提交时间：2019/04/30
Effect of Cu6Sn5 particles on microstructure formation and mechanical properties of Sn-58Bi solder 会议论文
13th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), Guilin, PEOPLES R CHINA, 2012-08-13
作者:  Liu, Xiaoying;  Huang, Mingliang;  Zhao, Ning
收藏  |  浏览/下载：1/0  |  提交时间：2019/12/13
Corrosion Behavior of 64Sn-35Bi-1Ag Solder Doped with Zn in NaCl Solution and its Electrochemical Migration Characteristics in High Humid Thermal Condition for Electronic Packaging 会议论文
12th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011-08-08
作者:  Hua, L.[1];  Zhang, J. S.[2]
收藏  |  浏览/下载：7/0  |  提交时间：2019/04/30
Microstructural Evolution of Sn3.0Ag0.5Cu3.0Bi0.05Cr/Cu Solder Joints During Thermal Aging and Its Effects on Mechanical Properties 会议论文
CHINA SEMICONDUCTOR TECHNOLOGY INTERNATIONAL CONFERENCE 2011 (CSTIC 2011), 2011-03-13
作者:  Lin, F.[1];  Bi, W. Z.[2];  Ju, G. K.[3];  Wei, X. C.[4]
收藏  |  浏览/下载：2/0  |  提交时间：2019/04/30
Effect of 3.0wt. %Bi and 0.05wt. %Cr Additions on the Microstructure and Tensile Strength of the Sn3Ag0.5Cu/Cu Solder Joint 会议论文
2010 11TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP), 2010-08-16
作者:  Han, Yongjiu[1];  Lin, Fei[2];  Ju, Guokui[3];  Wei, Xicheng[4]
收藏  |  浏览/下载：4/0  |  提交时间：2019/04/30
Microstructure and Property of Sn-Zn-Cu-Bi Lead Free Solder 会议论文
11th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), AUG 16-19, 2010
作者:  Liu Xiuzhong;  Yang Min;  Liu Xinghong;  Dai Jiahui
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/31
Manufacture, Microstructure and Microhardness Analysis of Sn-Bi Lead-Free Solder Reinforced with Sn-Ag-Cu Nano-particles 会议论文
2008 INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING, VOLS 1 AND 2, 2008-07-28
作者:  Zhang, Lili[1];  Tao, Wenkai[2];  Liu, Johan[3];  Zhang, Yan[4];  Cheng, Zhaonian[5]
收藏  |  浏览/下载：1/0  |  提交时间：2019/05/06
Study of interfacial reactions in Sn-3.5Ag-3.0Bi sandwich structure solder joint with Ni(P)/Cu metallization on Cu substrate 会议论文
ICEPT: 2006 7th International Conference on Electronics Packaging Technology, Proceedings
作者:  Chen, Si[1];  Sun, Peng[2];  Liu, Johan[3];  Wei, Xicheng[4];  Cheng, Zhaonian[5]
收藏  |  浏览/下载：2/0  |  提交时间：2019/05/10

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