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The influence of sintering process on thermal properties of nano-silver paste 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Lu, Xiuzhen[1];  Zhang, Qianran[2];  Zehri, Abdelhafid[3];  Ke, Wei[4];  Huang, Shirong[5]
收藏  |  浏览/下载:15/0  |  提交时间:2019/04/22
The Preparation of Monodisperse Silver Nanoparticles and its Application in Flexible Printed Electronics 会议论文
Harbin, China
作者:  Weifang Shao;  Pengli Zhu;  Yougen Hu;  Rong Sun;  Chingping Wong
收藏  |  浏览/下载:19/0  |  提交时间:2018/02/02
Synthesis and characterization of silica-silver core-shell structural spheres and its application in conductive adhesive 会议论文
18th International Conference on Electronic Packaging Technology (ICEPT), IEEE, Harbin, PEOPLES R CHINA
作者:  Li, Jinze;  Zhang, Baotan;  Zhu, Pengli;  Gao, Yuan;  Sun, Rong
收藏  |  浏览/下载:4/0  |  提交时间:2020/01/03
Synthesis and characterization of silica-silver core-shell structural spheres and its application in conductive adhesive 会议论文
2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017-01-01
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收藏  |  浏览/下载:5/0  |  提交时间:2020/01/03
Preparation of highly conductive adhesives by in-stiu incorporation of silver nanoparticles 会议论文
The 17th International Conference on electronic packing Technology (ICEPT 2016), Changsha,China
作者:  Yankang Han;  Baotan Zhang;  Pengli Zhu;  Shulei Huang;  Qianqian Liu
收藏  |  浏览/下载:32/0  |  提交时间:2017/01/15
Preparation of highly conductive adhesives by in-stiu incorporation of silver nanoparticles 会议论文
2016 17TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2016-01-01
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收藏  |  浏览/下载:3/0  |  提交时间:2020/01/03
Preparation of highly conductive adhesives by in-stiu incorporation of silver nanoparticles 会议论文
17th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Elect Mfg & Packaging Technol Soc, Wuhan, PEOPLES R CHINA
作者:  Han, Yankang;  Zhang, Baotan;  Zhu, Pengli;  Liu, Qianqian;  Hu, Yougen
收藏  |  浏览/下载:7/0  |  提交时间:2020/01/03
Facile Synthesis of Elliptical Cu-Ag Nanoplates forElectrically Conductive Adhesives 会议论文
The 16th International Conference on electronic packing Technology (ICEPT 2015), Changsha,China
作者:  Yu Zhang;  Pengli Zhu;  Gang Li;  Baotan Zhang;  Rong Sun
收藏  |  浏览/下载:12/0  |  提交时间:2016/01/27
P(St-AA)/Ag nano-composite particles as electricalconductive filler for conductive ink in printedelectronics 会议论文
The 16th International Conference on electronic packing Technology (ICEPT 2015), Changsha,China
作者:  Yougen Hu;  Pengli Zhu;  Tao Zhao;  Xianwen Liang;  Rong Sun
收藏  |  浏览/下载:29/0  |  提交时间:2016/01/27
Preparation and Antibacterial Effect of Nanopalygorskite Supported Nano-silver Powder 会议论文
作者:  Wang, Jian-Rong;  Liu, Ya-Li;  Liu, Bin
收藏  |  浏览/下载:7/0  |  提交时间:2019/11/15


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