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| The influence of sintering process on thermal properties of nano-silver paste 会议论文 2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01 作者: Lu, Xiuzhen[1]; Zhang, Qianran[2]; Zehri, Abdelhafid[3]; Ke, Wei[4]; Huang, Shirong[5] 收藏  |  浏览/下载:15/0  |  提交时间:2019/04/22
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| The Preparation of Monodisperse Silver Nanoparticles and its Application in Flexible Printed Electronics 会议论文 Harbin, China 作者: Weifang Shao; Pengli Zhu; Yougen Hu; Rong Sun; Chingping Wong 收藏  |  浏览/下载:19/0  |  提交时间:2018/02/02 |
| Synthesis and characterization of silica-silver core-shell structural spheres and its application in conductive adhesive 会议论文 18th International Conference on Electronic Packaging Technology (ICEPT), IEEE, Harbin, PEOPLES R CHINA 作者: Li, Jinze; Zhang, Baotan; Zhu, Pengli; Gao, Yuan; Sun, Rong 收藏  |  浏览/下载:4/0  |  提交时间:2020/01/03
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| Synthesis and characterization of silica-silver core-shell structural spheres and its application in conductive adhesive 会议论文 2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017-01-01 - 收藏  |  浏览/下载:5/0  |  提交时间:2020/01/03
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| Preparation of highly conductive adhesives by in-stiu incorporation of silver nanoparticles 会议论文 The 17th International Conference on electronic packing Technology (ICEPT 2016), Changsha,China 作者: Yankang Han; Baotan Zhang; Pengli Zhu; Shulei Huang; Qianqian Liu 收藏  |  浏览/下载:32/0  |  提交时间:2017/01/15 |
| Preparation of highly conductive adhesives by in-stiu incorporation of silver nanoparticles 会议论文 2016 17TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2016-01-01 - 收藏  |  浏览/下载:3/0  |  提交时间:2020/01/03
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| Preparation of highly conductive adhesives by in-stiu incorporation of silver nanoparticles 会议论文 17th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Elect Mfg & Packaging Technol Soc, Wuhan, PEOPLES R CHINA 作者: Han, Yankang; Zhang, Baotan; Zhu, Pengli; Liu, Qianqian; Hu, Yougen 收藏  |  浏览/下载:7/0  |  提交时间:2020/01/03
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| Facile Synthesis of Elliptical Cu-Ag Nanoplates forElectrically Conductive Adhesives 会议论文 The 16th International Conference on electronic packing Technology (ICEPT 2015), Changsha,China 作者: Yu Zhang; Pengli Zhu; Gang Li; Baotan Zhang; Rong Sun 收藏  |  浏览/下载:12/0  |  提交时间:2016/01/27 |
| P(St-AA)/Ag nano-composite particles as electricalconductive filler for conductive ink in printedelectronics 会议论文 The 16th International Conference on electronic packing Technology (ICEPT 2015), Changsha,China 作者: Yougen Hu; Pengli Zhu; Tao Zhao; Xianwen Liang; Rong Sun 收藏  |  浏览/下载:29/0  |  提交时间:2016/01/27 |
| Preparation and Antibacterial Effect of Nanopalygorskite Supported Nano-silver Powder 会议论文 作者: Wang, Jian-Rong; Liu, Ya-Li; Liu, Bin 收藏  |  浏览/下载:7/0  |  提交时间:2019/11/15
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