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Numerical Simulation Research on Thermal Response Characteristics of E-type Coaxial Thermocouples 会议论文
长沙, 2021/09/12
作者:  Qi L(齐力);  Han GL(韩桂来);  Jiang ZL(姜宗林)
收藏  |  浏览/下载：10/0  |  提交时间：2022/07/06
Thermal control design and analysis of a zoom TV optical mechanical system 会议论文
Xi'an, China, 2018-12-05
作者:  Zhang, Yue;  Shi, Kui;  Wang, Huan;  Zhang, Gaopeng;  Qu, Rui
收藏  |  浏览/下载：23/0  |  提交时间：2019/04/02
Hot stretch forming of titanium sheet by resistance heating 会议论文
MATEC Web of Conferences
作者:  Li, X.;  Dong, H.;  Guo, G.;  Li, D.
收藏  |  浏览/下载：7/0  |  提交时间：2019/12/30
Optimization of microchannel cooler of high power diode laser array package 会议论文
components and packaging for laser systems iii 2017, san francisco, ca, united states, 2017-01-31
作者:  Wu, Dihai;  Zhang, Pu;  Nie, Zhiqiang;  Liang, Xuejie;  Wang, Jingwei
收藏  |  浏览/下载：14/0  |  提交时间：2017/06/08
PORO-ELASTOPLASTIC MODELLING OF UPLIFT RESISTANCE OF SHALLOWLY-BURIED PIPELINES 会议论文
Trondheim, NORWAY, JUN 25-30, 2017
作者:  Qi WG(漆文刚);  Shi YM;  Gao FP(高福平);  Qi, WG (reprint author), Chinese Acad Sci, Key Lab Mech Fluid Solid Coupling Syst, Inst Mech, Beijing, Peoples R China.
收藏  |  浏览/下载：24/0  |  提交时间：2018/01/16
Sand  Wave  Pipes  
Poro-elastoplastic modelling of uplift resistance of shallowlyburied pipelines 会议论文
Trondheim, Norway, June 25, 2017 - June 30, 2017
作者:  Qi WG(漆文刚);  Shi YM(师玉敏);  Gao FP(高福平)
收藏  |  浏览/下载：44/0  |  提交时间：2018/11/08
Influence of Hollow Block's Structural Configuration on the Thermal Characteristics of Hollow Block Wall 会议论文
10TH INTERNATIONAL SYMPOSIUM ON HEATING, VENTILATION AND AIR CONDITIONING, ISHVAC2017, 2017-01-01
作者:  Zhang, Yuan[1];  Wang, Qian[2]
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/24
Thermal behavior of microchannel cooled high power diode laser arrays 会议论文
17th international conference on electronic packaging technology, icept 2016, wuhan, china, 2016-08-16
作者:  Wu, Dihai;  Zhang, Pu;  Nie, Zhiqiang;  Xiong, Lingling;  Song, Yunfei
收藏  |  浏览/下载：30/0  |  提交时间：2016/11/22
Fabricating Photosensitive Polymer Insulation Layer by Spin-coating for Through Silicon Vias 会议论文
The 17th International Conference on electronic packing Technology (ICEPT 2016), Changsha,China
作者:  Qiang Liu;  Guoping Zhang;  Rong Sun;  S. W. Ricky Lee;  C. P. Wong
收藏  |  浏览/下载：21/0  |  提交时间：2017/01/15
The analysis and test of the thermal shock resistance of the Multi-spectral CVD ZnS dome 会议论文
International Symposium on Infrared Technology and Application and the International Symposiums on Robot Sensing and Advanced Control, Beijing, May 9-11, 2016
作者:  Zhang DJ(张代军);  Luo HB(罗海波);  Zhou PP(周培培);  Hou XL(侯幸林)
收藏  |  浏览/下载：29/0  |  提交时间：2016/09/13

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