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CORC

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Post-Growth Processing of Carbon Nanotubes for Interconnect Applications - A Review 会议论文
6th Electronic System-Integration Technology Conference (ESTC)
作者:  Fu, Yifeng[1];  Mu, Wei[2];  Sun, Shuangxi[3];  Wang, Ning[4];  Huang, Shirong[5]
收藏  |  浏览/下载：22/0  |  提交时间：2019/04/26
Carbon nanotube/solder hybrid structure for interconnect applications 会议论文
5th Electronics System-Integration Technology Conference, ESTC 2014, 2014-09-16
作者:  Jiang, Di[1];  Sun, Shuangxi[2];  Mu, Wei[3];  Fu, Yifeng[4];  Liu, Johan[5]
收藏  |  浏览/下载：3/0  |  提交时间：2019/04/30
CHEMICALLY VAPOR DEPOSITED CARBON NANOTUBES FOR VERTICAL ELECTRONICS INTERCONNECT IN PACKAGING APPLICATIONS 会议论文
IEEE International Conference on Solid-State and Integrated Circuit Technology, 2014-10-28
作者:  Liu, Johan[1];  Fu, Yifeng[2];  Jiang, Di[3]
收藏  |  浏览/下载：1/0  |  提交时间：2019/04/30
High-temperature Oxidation and Novel Protective Coatings of Fe-Cr Ferritic Steels as Metallic Interconnect Materials for SOFC Applications 会议论文
international union of materials research societies - international conference on electronic materials 2012, 横滨, 2012-9-23
区定容; 程谟杰
收藏  |  浏览/下载：14/0  |  提交时间：2013/10/10
Grid Memory Service Architecture for High Performance Computing 会议论文
Proceedings - 7th International Conference on Grid and Cooperative Computing, GCC 2008
Lei Li; Siyuan Liu; Mingyu Chen; Jianping Fan
收藏  |  浏览/下载：11/0  |  提交时间：2015/08/21
Recent Development of Nano-solder Paste for Electronics Interconnect Applications 会议论文
10th Electronics Packing Technology Conference, 2008-12-09
作者:  Liu, Johan[1];  Andersson, Cristina[2];  Gao, Yulai[3];  Zhai, Qijie[4]
收藏  |  浏览/下载：1/0  |  提交时间：2019/05/06
Interconnecting IPv4/IPv6 metwork in pure IPv6 backbones with extended IPv4-over-IPv6 mechanism 会议论文
作者:  Jian Song;  Huang, Mian;  Sun, Wei;  Jiao, Yu;  Zhang, Baojie
收藏  |  浏览/下载：10/0  |  提交时间：2019/11/15
The design and research of a 40ver6 extended mechanism 会议论文
作者:  Sun, Wei;  Huang, Mian;  Song, Jian;  Jiao, Yu
收藏  |  浏览/下载：13/0  |  提交时间：2019/11/15
Ontology for the anisotropic conductive adhesive interconnect technology for electronics packaging applications 会议论文
2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'05, 2005-06-27
作者:  Liu, Johan[1];  Wang, Yu[2];  Morris, James[3];  Kristiansen, Helge[4]
收藏  |  浏览/下载：4/0  |  提交时间：2019/05/10
An ontology for isotropic conductive adhesive interconnect technology in electronics packaging applications 会议论文
2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'05, 2005-06-27
作者:  Morris, James E.[1];  Lee, Jeahuck[2];  Liu, Johan[3]
收藏  |  浏览/下载：5/0  |  提交时间：2019/05/10

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