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A Multi-modal Global Instance Tracking Benchmark (MGIT): Better Locating Target in Complex Spatio-temporal and causal Relationship 会议论文
New Orleans, 2023-12
作者:  Shiyu, Hu;  Dailing, Zhang;  Meiqi, Wu;  Xiaokun, Feng;  Xuchen, Li
收藏  |  浏览/下载：0/0  |  提交时间：2024/01/22
A metal-organic framework-derived pseudocapacitive titanium oxide/carbon core/shell heterostructure for high performance potassium ion hybrid capacitors 会议论文
作者:  Li, Hongxia;  Chen, Jiangtao;  Zhang, Li;  Wang, Kunjie;  Zhang, Xu
收藏  |  浏览/下载：6/0  |  提交时间：2020/12/18
Effect of Cryogenic Treatment on Extruded Copper Structures 会议论文
Jiaozuo, China, September 20, 2019 - September 22, 2019
作者:  Shengquan, Zhang;  Bing, Wang;  Shizhuo, Wang;  Changzhong, Zhao;  Xijing, Wang
收藏  |  浏览/下载：2/0  |  提交时间：2020/11/15
Nanodust in the Heliosphere 会议论文
Pasadena, CA, United states, February 18, 2019 - February 22, 2019
作者:  Ip, Wing-Huen;  Lai, Ian-Lin;  Shen, Fang
收藏  |  浏览/下载：22/0  |  提交时间：2019/12/26
Microstructure damage in silicon carbide fiber induced by 246.8-MeV Ar-ion irradiation 会议论文
作者:  Zhang, Liqing;  Zhang, Chonghong;  Huang, Qing;  Ding, Zhaonan;  Yan, Tingxing
收藏  |  浏览/下载：40/0  |  提交时间：2019/03/27
Corrosion behavior of incoloy 825 in high temperature vapor containing sodium chloride 会议论文
作者:  Yang, Jianqiao;  Wang, Shuzhong;  Wang, Dong;  Li, Jianna;  Xu, Donghai
收藏  |  浏览/下载：6/0  |  提交时间：2019/11/19
Investigation of dimensional effect in ZnO ceramics through high-temperature relaxation 会议论文
作者:  Xin, Lei;  Huang, Yuwei;  Wu, Kangning;  Tang, Zhuang;  Li, Jianying
收藏  |  浏览/下载：3/0  |  提交时间：2019/11/19
Growth mechanism of Cu3Sn grains in the (111) Cu/Sn/Cu micro interconnects 会议论文
19th International Conference on Electronic Packaging Technology, ICEPT 2018, Shanghai, China, 2018-08-08
作者:  Zhong, Yi;  Zhao, Ning;  Dong, Wei;  Wang, Yunpeng;  Ma, Haitao
收藏  |  浏览/下载：7/0  |  提交时间：2019/12/02
Growth mechanism of Cu3Sn grains in the (111)Cu/Sn/Cu micro interconnects 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Zhong, Yi;  Zhao, Ning;  Dong, Wei;  Wang, Yunpeng;  Ma, Haitao
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/02
Growth Behavior of Cu6Sn5 Grains at Sn/(001)Cu Interface by Imposing Temperature Gradient 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Zhao, Ning;  Chen, Shi;  Liu, Chunying;  Zhong, Yi;  Ma, Haitao
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/02

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