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CORC

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Silver flakes filled Interpenetrating Polymer Network (IPN): high performance electrically conductive adhesives for electronic packaging 会议论文
China Semiconductor Technology International Conference 2016, CSTIC 2016, Shanghai, China
作者:  Yankang Han;  Baotan Zhang;  Pengli Zhu;  Shulei Huang;  Rong Sun
收藏  |  浏览/下载：23/0  |  提交时间：2017/01/15
Mesoporous Silica Nanoparticles: A Potential Inorganic Filler To Prepare Polymer Composites With Low CTE And Low Modulus For Electronic Packaging Applications 会议论文
2016 IEEE 66TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), Las Vegas, NV
作者:  Li, Gang;  Zhu, Pengli;  Zhao, Tao;  Sun, Rong;  Lu, Daoqiang
收藏  |  浏览/下载：23/0  |  提交时间：2017/01/15
Facile Low-voltage Electrowetting on Dielectrics Using CYTOPTM as The Hydrophobic and Insulating Layer 会议论文
中国微米纳米技术学会第17次年会 CSMNT 2015, Shanghai， China
作者:  Lijun Li;  Jiahao Wu;  Lin Luan;  Tianzhun W
收藏  |  浏览/下载：18/0  |  提交时间：2016/01/27
Effect of Functionalized Multiwalled Carbon Nanotubes on the Coefficient of Thermal Expansion of Bismaleimide-Triazine resins (BT resins) 会议论文
The 65th Electronic Componenets and Technology Conference, San Diego, California, USA
作者:  Xiaoliang Zeng;  Shuhui Yu;  Rong Sun;  Jianbin Xu;  Ching-Ping Wong
收藏  |  浏览/下载：19/0  |  提交时间：2016/01/27
Insights into the role of surface hydroxyl of the silica fillers in the bulk properties of resulting underfills 会议论文
The 16th International Conference on electronic packing Technology (ICEPT 2015), Changsha,China
作者:  Gang Li;  Pengli Zhu;  Qian Guo;  Rong Sun;  Daoqiang (Daniel) Lu
收藏  |  浏览/下载：10/0  |  提交时间：2016/01/27
Preparation of raspberry-like SiO2 nanoparticles and thermo-mechanical properties of its epoxy composites 会议论文
Proceedings of the Electronic Packaging Technology Conference, EPTC,, 中国
作者:  Huang, Liang;  Li, Gang;  Zhu, Pengli;  Sun, Rong;  Lu, Daoqiang Daniel
收藏  |  浏览/下载：12/0  |  提交时间：2015/09/01
A study of underfill using two kinds of Silica as inorganic filler 会议论文
2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013, Dalian, China
作者:  Zhang Wenjie;  Zhu Pengli;  Zhao Tao;  Sun Rong;  Wong Chingping
收藏  |  浏览/下载：6/0  |  提交时间：2015/08/27
High thermal conductive BT resin/silicon nitride composites 会议论文
2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011, Shanghai, China
作者:  Zeng, Xiaoliang;  Yu, Shuhui;  Sun, Rong;  Du, Ruxu
收藏  |  浏览/下载：10/0  |  提交时间：2015/08/25
Study of PVC Plasticized by Octodecyl Acyl Tributyl Citrate 会议论文
作者:  Cui, Jinfeng;  Guo, Junhong;  Ma, Yongqiang;  Li, Yanhua;  Qing, Caixia
收藏  |  浏览/下载：0/0  |  提交时间：2019/11/15
Study of PVC plasticized by octodecyl acyl tributyl citrate 会议论文
Changsha, China, May 28, 2011 - May 30, 2011
作者:  Cui, Jinfeng;  Guo, Junhong;  Ma, Yongqiang;  Li, Yanhua;  Qing, Caixia
收藏  |  浏览/下载：11/0  |  提交时间：2020/11/15

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