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A New Type of Unitized Design for the Structure of a Space Camera using Topology Optimization
会议论文
Xian, PEOPLES R CHINA, 2020-10-15
作者:
Ye Jing
;
Song Yang
;
Duan Yongqiang
;
Hu Yongming
;
Hu Bin
收藏
  |  
浏览/下载:14/0
  |  
提交时间:2021/07/23
Topology Optimization
Unitized Design
Space Camera
First-principles study of electronic structure, optical properties and lo-to splitting of gap
会议论文
5th Conference on New Advances in Condensed Matter Physics, NACMP 2018, Kunming, China, 2018-08-21
作者:
Zhang, XianBin
;
Wu, WenJie
;
Deng, NingKang
;
Wei, XuYan
;
Wang, GuanQi
收藏
  |  
浏览/下载:6/0
  |  
提交时间:2019/12/20
First-principles study of electronic, mechanical and optical properties of mixed valence SmB6
会议论文
4th International Conference on Advanced Composite Materials and Manufacturing Engineering (ACMME), PEOPLES R CHINA, MAY 20-21, 2017
作者:
Xiao, Lihua*
;
Su, Yuchang
;
Peng, Ping
;
Tang, Dongsheng
收藏
  |  
浏览/下载:1/0
  |  
提交时间:2019/12/03
First-principles study of electronic, mechanical and optical properties of mixed valence SmB6
会议论文
PEOPLES R CHINA, MAY 20-21, 2017
作者:
Xiao, Lihua
;
Su, Yuchang
;
Peng, Ping
;
Tang, Dongsheng
收藏
  |  
浏览/下载:7/0
  |  
提交时间:2019/12/31
Thermal behavior of microchannel cooled high power diode laser arrays
会议论文
17th international conference on electronic packaging technology, icept 2016, wuhan, china, 2016-08-16
作者:
Wu, Dihai
;
Zhang, Pu
;
Nie, Zhiqiang
;
Xiong, Lingling
;
Song, Yunfei
收藏
  |  
浏览/下载:30/0
  |  
提交时间:2016/11/22
Computational fluid dynamics
Copper
Crosstalk
Diodes
Electronics packaging
Finite element method
Flow of water
Heat resistance
Heat sinks
Hydraulics
Laser beam welding
Microchannels
Numerical methods
Optical properties
Power semiconductor diodes
Reliability
Thermodynamic properties
Numerical simulation of thermo-mechanical behavior in high power diode laser arrays
会议论文
17th international conference on electronic packaging technology, icept 2016, wuhan, china, 2016-08-16
作者:
Lu, Yao
;
Nie, Zhiqiang
;
Zhang, Pu
;
Wang, Zhenfu
;
Xiong, Lingling
收藏
  |  
浏览/下载:40/0
  |  
提交时间:2016/11/22
Computer simulation
Electronics packaging
High power lasers
Numerical models
Occupational risks
Optical properties
Packaging
Power semiconductor diodes
Shear stress
Thermal stress
One-step fabrication of super-hydrophobic surface on thermoplastic substrates with hybrid micro/nano-scale structures
会议论文
International Conference of Microfluidics, Nanofluidics and Lab-on-a-Chip, Dalian
作者:
Hongtao Feng
;
Weiliang Shu
;
Baoyue Zhang
;
Jingjing Wang
;
Yan Chen
收藏
  |  
浏览/下载:26/0
  |  
提交时间:2017/01/15
Underfill Technology for Fine Pitch Flip Chip Application
会议论文
The 17th International Conference on electronic packing Technology (ICEPT 2016), Changsha,China
作者:
Pengli Zhu
;
Gang Li
;
Qian Guo
;
Tao Zhao
;
Daoqiang Lu
收藏
  |  
浏览/下载:41/0
  |  
提交时间:2017/01/15
A Microwave-Assisted Solvothermal Process to Synthesize Al-Doped ZnO Powders for Transparent and Conductive Packing Materals
会议论文
The 17th International Conference on electronic packing Technology (ICEPT 2016), Changsha,China
作者:
Qianqian Liu
;
Pengli Zhu
;
Gang Li
;
Qian Guo
;
Rong Sun
收藏
  |  
浏览/下载:9/0
  |  
提交时间:2017/01/15
Fabrication of graphene MEMS by standard transfer: High performance atomic force microscope tips
会议论文
Hui, Fei
;
Porti, Marc
;
Nafria, Montserrat
;
Duan, Huiling
;
Lanza, Mario
收藏
  |  
浏览/下载:4/0
  |  
提交时间:2017/12/03
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