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Effects of process parameters on vacuum hot bulge forming process on reactor coolant pump rotor-can with ring-shaped outward defect 会议论文
2ND INTERNATIONAL WORKSHOP ON MATERIALS SCIENCE AND MECHANICAL ENGINEERING (IWMSME2018), 2019-01-01
作者:  Cui, Y.;  Zhang, L. W.;  Zhang, C.;  Li, F.
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/02
A study on determination of optimum parameters for lubrication in external cylindrical grinding base on Taguchi method 会议论文
作者:  Tu, Hoang Xuan;  Pi, Vu Ngoc;  Jun, Gong
收藏  |  浏览/下载：0/0  |  提交时间：2020/11/15
THE CONCEPT STUDY ON THE NEW STEAM COOLING REACTOR 会议论文
作者:  Yan, Xuesong;  Zhang, Xunchao;  Zhang, Yaling;  Yang, Yangyang;  Yang, Lei
收藏  |  浏览/下载：26/0  |  提交时间：2018/08/20
THE CONCEPT STUDY ON THE NEW STEAM COOLING REACTOR 会议论文
作者:  ASME;  Yan, Xuesong;  Zhang, Xunchao;  Zhang, Yaling;  Yang, Yangyang
收藏  |  浏览/下载：17/0  |  提交时间：2018/08/20
Experimental Studies of Film Cooling in Supersonic Combustors 会议论文
Xiamen, China, 6-9 March 2017
作者:  Fan C(樊川);  Wang J(王晶);  Fan XJ(范学军)
收藏  |  浏览/下载：24/0  |  提交时间：2018/01/16
CONTROL SCHEME RESEARCH OF 10MW FLUORIDE SALT COOLED HIGH TEMPERATURE EXPERIMENT REACTOR 会议论文
Shanghai, PEOPLES R CHINA, JUL 02-06, 2017
作者:  Ruan, J;  Zou, Y;  Li, MH;  Xu, HJ
收藏  |  浏览/下载：15/0  |  提交时间：2019/12/31
Heat Transfer and Flow Characteristics in 90 deg Ribbed Duct Using Different Coolants 会议论文
ASME, San Antonio,Texas,USA, 2013
Fifi N. M. Elwekeel; Antar M. M. Abdala;  Qun Zheng
收藏  |  浏览/下载：6/0  |  提交时间：2013/11/26
Performance Assessment of a Closed-Loop Minichannel Heat Sink Using Water and FC-72 as Coolants 会议论文
HEAT TRANSFER ENGINEERING, 2013-01-01
作者:  Hu, Xiao;  Lin, Guiping;  Cai, Yan;  Bu, Xueqin;  Wen, Dongsheng
收藏  |  浏览/下载：4/0  |  提交时间：2020/01/06
Experimental determination of convective heat transfer coefficient in WEDM 会议论文
International Technology and Innovation Conference 2006. ITIC 2006, International Technology and Innovation Conference 2006. ITIC 2006, Hangzhou, China, INSPEC
Cheng Gang; Han Fuzhu; Feng Zhijing
收藏  |  浏览/下载：2/0
A study of effects of coolants on heat transfer capability of on-chip cooling with CNT micro-fin Architectures by using CFD simulation 会议论文
HDP'07: PROCEEDINGS OF THE 2007 INTERNATIONAL SYMPOSIUM ON HIGH DENSITY PACKAGING AND MICROSYSTEM INTEGRATION, 2007-06-26
作者:  Fan, Yi[1];  Zhong, Xiaolong[2];  Liu, Johan[3];  Wang, Teng[4];  Zhang, Yan[5]
收藏  |  浏览/下载：1/0  |  提交时间：2019/05/10

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