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CORC

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Growth mechanism of Cu3Sn grains in the (111)Cu/Sn/Cu micro interconnects 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Zhong, Yi;  Zhao, Ning;  Dong, Wei;  Wang, Yunpeng;  Ma, Haitao
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/02
Effect of Temperature Gradient on Interfacial Reactions in Cu/Sn-9Zn/Ni Solder Joints during Aging 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Zhao, Ning;  Wang, Mingyao;  Zhong, Yi;  Ma, Haitao;  Wang, Yunpeng
收藏  |  浏览/下载：19/0  |  提交时间：2019/12/02
Growth Behavior of Cu6Sn5 Grains at Sn/(001)Cu Interface by Imposing Temperature Gradient 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Zhao, Ning;  Chen, Shi;  Liu, Chunying;  Zhong, Yi;  Ma, Haitao
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/02
Formation of preferred orientation of Cu6Sn5 grains in Cu/Sn/Cu interconnects by soldering under temperature gradient 会议论文
2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017-01-01
作者:  Zhong, Yi;  Zhao, Ning;  Dong, Wei;  Ma, Haitao;  Wang, Yunpeng
收藏  |  浏览/下载：6/0  |  提交时间：2019/12/03
Study on interfacial reactions in Cu/Sn-9Zn/Ni micro solder joints under temperature gradient 会议论文
2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017-01-01
作者:  Zhao, Ning;  Wang, Mingyao;  Zhong, Yi;  Ma, Haitao;  Wang, Yunpeng
收藏  |  浏览/下载：10/0  |  提交时间：2019/12/03
Low temperature Ni/Sn/Ni transient liquid phase bonding for high temperature packaging applications by imposing temperature gradient 会议论文
2017 IEEE 67TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2017), 2017-01-01
作者:  Zhong, Y.;  Zhao, N.;  Ma, H. T.;  Dong, W.;  Huang, M. L.
收藏  |  浏览/下载：5/0  |  提交时间：2019/12/09
Synchrotron radiation in situ study on the solidification of Cu/Sn-58Bi/Cu solder joint under temperature gradient 会议论文
17th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Elect Mfg & Packaging Technol Soc, Wuhan, PEOPLES R CHINA, 2016-08-16
作者:  Zhao, Ning;  Zhong, Yi;  Huang, Mingliang;  Ma, Haitao;  Dong, Wei
收藏  |  浏览/下载：8/0  |  提交时间：2019/12/09
A Study of Thickening Phenomenon in Laser bending Zone of a Metal 会议论文
18th CIRP Conference on Electro Physical and Chemical Machining (ISEM), Univ Tokyo, Hongo Campus, Tokyo, JAPAN
作者:  Wang, Xuyue;  Ma, Xupeng;  Li, Zihui;  Wang, Rui
收藏  |  浏览/下载：1/0  |  提交时间：2019/12/09
Interfacial reactions in Cu/Sn/Cu(Ni) systems during soldering under temperature gradient 会议论文
16 int conf elect packaging technology, Chinese Inst Elect,China IEEE Component Packaging, & Mfg Tech Soci IEEE-C, Changsha, PEOPLES R CHINA, 2015-08-11
作者:  Zhao, Ning;  Zhong, Yi;  Huang, Mingliang;  Ma, Haitao
收藏  |  浏览/下载：1/0  |  提交时间：2019/12/09
Design Thermal Gradients for Straddle Track Girders 会议论文
International Conference on Structures and Building Materials, Guangzhou, PEOPLES R CHINA, 2011-01-07
作者:  Zhang Tao;  Bai haifeng
收藏  |  浏览/下载：1/0  |  提交时间：2019/12/18

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