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CORC

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The sixth visual object tracking VOT2018 challenge results 会议论文
15th European Conference on Computer Vision, ECCV 2018, Munich, Germany, 2018-09-08
作者:  Kristan, Matej;  Leonardis, Ale;  Matas, Jií;  Felsberg, Michael;  Pflugfelder, Roman
收藏  |  浏览/下载：140/0  |  提交时间：2019/12/02
Bounds on the total signed domination number of generalized Petersen graphs P(n,3) 会议论文
2018 INTERNATIONAL SYMPOSIUM ON POWER ELECTRONICS AND CONTROL ENGINEERING (ISPECE 2018), 2019-01-01
作者:  Gao, Hong;  Yin, Yanan;  Yang, Yuansheng
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/02
SoftwareHardware co-design for multichannel scheduling in IEEE 802.11p 会议论文
International Symposium on Field-Programmable Gate Arrays（FPGA 2018 ）
作者:  Ding N(丁男);  Ma YH(马艳华);  Gao ZG(高振国)
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/02
The effect of reflow temperature on IMC growth in Sn/Cu and Sn0.7Cu/Cu solder bumps during multiple reflows 会议论文
2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017-01-01
作者:  Ma, H. R.;  Wang, Y. P.;  Chen, J.;  Ma, H. T.;  Zhao, N.
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/03
The effect of cooling rate on growth kinetics of interfacial IMCs during multiple reflows 会议论文
2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017-01-01
作者:  Ma, H. R.;  Li, S.;  Yao, M. J.;  Wang, Y. P.;  Chen, J.
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/03
The effect of cooling rate on growth kinetics of interfacial IMCs during multiple reflows 会议论文
18th International Conference on Electronic Packaging Technology, ICEPT 2017, Harbin, China, 2017-08-16
作者:  Ma, H.R.;  Li, S.;  Yao, M.J.;  Wang, Y.P.;  Chen, J.
收藏  |  浏览/下载：6/0  |  提交时间：2019/12/03
The effect of reflow temperature on IMC growth in Sn/Cu and Sn0.7Cu/Cu solder bumps during multiple reflows 会议论文
18th International Conference on Electronic Packaging Technology, ICEPT 2017, Harbin, China, 2017-08-16
作者:  Ma, H.R.;  Wang, Y.P.;  Chen, J.;  Ma, H.T.;  Zhao, N.
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/03
Low temperature Ni/Sn/Ni transient liquid phase bonding for high temperature packaging applications by imposing temperature gradient 会议论文
2017 IEEE 67TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2017), 2017-01-01
作者:  Zhong, Y.;  Zhao, N.;  Ma, H. T.;  Dong, W.;  Huang, M. L.
收藏  |  浏览/下载：5/0  |  提交时间：2019/12/09
Effect of severe cold-rolling and annealing on microstructure and mechanical properties of AlCoCrFeNi2.1 eutectic high entropy alloy 会议论文
7th International Conference on Nanomaterials by Severe Plastic Deformation, Sydney, AUSTRALIA, 2017-07-02
作者:  Wani, I. S.;  Bhattacharjee, T.;  Sheikh, S.;  Lu, Y.;  Chatterjee, S.
收藏  |  浏览/下载：5/0  |  提交时间：2019/12/09
A Novel Reputation Management Mechanism with Forgiveness in P2P File Sharing Networks 会议论文
11th International Conference on Future Networks and Communications (FNC) / 13th International Conference on Mobile Systems and Pervasive Computing (MobiSPC), Montreal, CANADA, 2016-08-15
作者:  Li, Mingchu;  Wang, Junlong;  Lu, Kun;  Guo, Cheng;  Tan, Xing
收藏  |  浏览/下载：5/0  |  提交时间：2019/12/09

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