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兰州理工大学 [49]

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限定条件	内容类型：会议论文专题：兰州理工大学第一署名单位第一作者单位通讯作者单位

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	Evolution of the mechanical properties of a cobalt-based alloy under thermal shocks 会议论文作者: Wen, Junxia; Che, Hongyan; Cao, Rui; Dong, Hao; Ye, Youxiong 收藏 \| 浏览/下载：2/0 \| 提交时间：2020/12/18 Carbides Electronics packaging Hot isostatic pressing Mechanical properties Microstructural evolution Nanoindentation Scanning electron microscopy Sintering Thermal fatigue Thermal shockCarbide particles Cobalt base alloys Cobalt based alloy Energy dispersion spectrum High stress concentration Nanoindentation tests Reduced modulus Thermal fatigue cracks
	Tensile stiffness of elastomeric isolation bearings under shear deformation 会议论文 Changchun, China, July 1, 2017 - July 2, 2017 作者: Dang, Y.; Xu, Q.; Xu, L.L. 收藏 \| 浏览/下载：5/0 \| 提交时间：2020/11/15 Bearings (structural) Intelligent systems Intelligent vehicle highway systems Rubber Shear deformation Shear strain Horizontal displacements Isolation bearings Shaking table tests Shear behavior Tensile components Tensile failures Tensile stiffness Vertical displacements
	Experimental study of the mechanical properties of coarse-grained soils from high altitude and cold areas under freeze-thaw cycle 会议论文 Vienna, Austria, August 13, 2016 - August 16, 2016 作者: Qu, Yonglong; Chen, Guoliang; Niu, Fujun; Ni, Wankui; Mu, Yanhu 收藏 \| 浏览/下载：0/0 \| 提交时间：2020/11/15 Deformation Density (specific gravity) Freezing Geotechnical engineering Mechanical properties Moisture Moisture determination Soils Strain hardening Stress-strain curves Thawing Coarse-grained soils Deformation modulus Different moisture contents Dry density Freeze-thaw cycles High moisture contents Residual strength Triaxial test apparatus
	Effect of Zr and Cu on Mechanical Properties, Glass Forming Ability and Thermal Stability of Zr63.68Cu16.2 Ni-10.12 Al-10 Amorphous Alloy 会议论文作者: Li, Chunyan; Yin, Jinfeng; Ding, Juanqiang; Zhu, Fuping; Zhao, Yanchun 收藏 \| 浏览/下载：2/0 \| 提交时间：2019/11/15 Mechanical properties Serrated flow Work hardening Scale effect
	Effects of Hybrid Structure on Properties of Glass-Carbon Hybrid Fibers Composite 会议论文作者: Yang Rui; Liu Ye-yao; Wang Gong-xi; Wu Zhuo-qi 收藏 \| 浏览/下载：15/0 \| 提交时间：2019/11/15 hybrid structure glass-carbon hybrid fibers mechanical properties dispersion
	Influence of bearing materials on elastohydrodynamic lubrication of angular contact ball bearing 会议论文 Wuhan, Hubei, China, June 5, 2015 - June 6, 2015 作者: Wang, B.M.; Liao, X.Y.; Wu, Z.X.; Mei, X.S. 收藏 \| 浏览/下载：0/0 \| 提交时间：2020/11/15 Angular contact ball bearings Ceramic materials Elastic moduli Elasticity Environmental engineering Lubricating oils Materials Nitrogen compounds Point contacts Silicon carbide Silicon compounds Specific heat Zirconia Bearing temperature Calculating methods Comprehensive analysis Contrastive analysis Elastohydrodynamic lubrications (EHL) Full ceramic bearings Lubrication property Materials parameters
	Microstructure characterization of hypereutectoid aluminium bronze composite coating 会议论文作者: Kucita, P.; Wang, S. C.; Li, W. S.; Cook, R. B.; Starink, M. J. 收藏 \| 浏览/下载：12/0 \| 提交时间：2019/11/15
	Identification of elastic modulus and effective pre-stress based on inversion theory 会议论文 Kunming, China, December 14, 2013 - December 15, 2013 作者: Zhang, Zhao Ning 收藏 \| 浏览/下载：0/0 \| 提交时间：2020/11/15 Bridges Civil engineering Identification (control systems) Bridge in service Continuous beam bridges Direct impact Inversion analysis Inversion theory Object functions Strength and stiffness Vehicle load
	Effects of Polishing Parameters on the Evolution of 3-D Wafer Patterns during CMP 会议论文作者: Wu, Lixiao; Yan, Changfeng 收藏 \| 浏览/下载：12/0 \| 提交时间：2019/11/15
	Effects of polishing parameters on the evolution of 3-D wafer patterns during CMP 会议论文 Shanghai, China, March 19, 2013 - March 21, 2013 作者: Wu, Lixiao; Yan, Changfeng 收藏 \| 浏览/下载：0/0 \| 提交时间：2020/11/15 Polishing Pressure distribution Semiconductor device manufacture Silicon wafers Chemical mechanical polishing(CMP) Contact pressure distribution Linear modeling Magnitude spectrum Polishing parameters Polishing processs Polishing time Wafer patterns

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