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Mechanically Robust Atomic Oxygen-Resistant Coatings Capable of Autonomously Healing Damage in Low Earth Orbit Space Environment 期刊论文
ADVANCED MATERIALS, 2018, 卷号: 30, 期号: 36, 页码: -
作者:  Wang, XH;  Li, YX;  Qian, YH;  Qi, H;  Li, JQ
收藏  |  浏览/下载:24/0  |  提交时间:2018/12/25
Failure behavior of flip chip solder joint under coupling condition of thermal cycling and electrical current 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2018, 卷号: 29, 期号: 6, 页码: 5025-5033
作者:  Zhu, QS;  Gao, F
收藏  |  浏览/下载:20/0  |  提交时间:2018/06/05
Transport properties of MnTe films with cracks produced in thermal cycling process 期刊论文
SPRINGER, 2017, 卷号: 123, 期号: 10, 页码: -
作者:  Yang, Liang;  Wang, Zhenhua;  Zhang, Zhidong;  Wang, ZH (reprint author), Univ Chinese Acad Sci, Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, 72 Wenhua Rd, Shenyang 110016, Liaoning, Peoples R China.
收藏  |  浏览/下载:14/0  |  提交时间:2018/01/10
Influence of Cr addition on the interface purification of vacuum brazed NiCr-Cr3C2 coatings on single crystal superalloy 期刊论文
ELSEVIER SCIENCE SA, 2017, 卷号: 325, 页码: 200-209
作者:  Wang, D.;  Wang, W. Q.;  Chen, X. G.;  Chi, C. T.;  Wang, M. S.
收藏  |  浏览/下载:167/0  |  提交时间:2018/01/10
Failure Mechanisms of SAC/Fe-Ni Solder Joints During Thermal Cycling 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2017, 卷号: 46, 期号: 8, 页码: 5338-5348
Gao, Li-Yin; Liu, Zhi-Quan; Li, Cai-Fu
收藏  |  浏览/下载:34/0  |  提交时间:2017/08/17
The reliability of copper pillar under the coupling of thermal cycling and electric current stressing 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2016, 卷号: 27, 期号: 9, 页码: 9748-9754
Ma, HC; Guo, JD; Chen, JQ; Wu, D; Liu, ZQ; Zhu, QS; Zhang, L; Guo, HY
收藏  |  浏览/下载:22/0  |  提交时间:2016/12/28


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