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浏览/检索结果: 共2条，第1-2条 帮助 限定条件 学科主题：Physics, Applied     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Failure Mechanisms of SAC/Fe-Ni Solder Joints During Thermal Cycling 期刊论文 JOURNAL OF ELECTRONIC MATERIALS, 2017, 卷号: 46, 期号: 8, 页码: 5338-5348 Gao, Li-Yin; Liu, Zhi-Quan; Li, Cai-Fu 收藏  |  浏览/下载：34/0  |  提交时间：2017/08/17 Fe-Ni under bump metallization (UBM)  thermal cycling  microstructural evolution  lifetime  recrystallization  electron backscatter diffraction (EBSD)   Microstructure evolution and EBSD analysis of a graded steel fabricated by laser additive manufacturing 期刊论文 VACUUM, 2017, 卷号: 141, 页码: 68-81 Wang, Qiang; Zhang, Song; Zhang, ChunHua; Wu, Chenliang; Wang, Jianqiang; Chen, Jiang; Sun, Zulai 收藏  |  浏览/下载：30/0  |  提交时间：2017/08/17 Additive manufacturing  Graded steel  Direct laser metal deposition  Grain growth  Electron backscatter diffraction (EBSD)