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科研机构
金属研究所 [7]
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期刊论文 [7]
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2018 [5]
2017 [2]
学科主题
Materials ... [7]
Engineerin... [3]
Metallurgy... [3]
Physics, A... [3]
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学科主题：Materials Science, Multidisciplinary
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Local chemical ordering within the incubation period as a trigger for nanocrystallization of a highly supercooled Ti-based liquid
期刊论文
MATERIALS & DESIGN, 2018, 卷号: 156, 页码: 504-513
作者:
Wang, Z
;
Chen, CL
;
Ketov, SV
;
Akagi, K
;
Tsarkov, AA
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|
浏览/下载：28/0
|
提交时间：2018/12/25
Nucleation
Supercooled liquid
Metallic glass
Chemical inhomogeneity
Energy barrier
Mechanism of improved electromigration reliability using Fe-Ni UBM in wafer level package
期刊论文
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2018, 卷号: 34, 期号: 8, 页码: 1305-1314
作者:
Gao, LY
;
Zhang, H
;
Li, CF
;
Guo, JD
;
Liu, ZQ
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|
浏览/下载：29/0
|
提交时间：2018/12/25
Fe-Ni under bump metallization (UBM)
Intermetallic compounds (IMCs)
Electromigration (EM)
Diffusion
Vacancy formation
Fabrication of Ni-P coating film on diamond/Al composite and its soldering reliability
期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2018, 卷号: 29, 期号: 10, 页码: 8371-8379
作者:
Shi, QY
;
Liu, ZQ
;
Wu, D
;
Zhang, H
;
Ni, DR
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浏览/下载：30/0
|
提交时间：2018/06/05
Al/diamond Composites
Thermal-conductivity
Coated Diamond
Heat Sinks
Densification
Microstructure
Mechanisms
Strength
Surface
Growth
On the abnormal fast diffusion of solute atoms in alpha-Ti: A first-principles investigation
期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2018, 卷号: 740, 页码: 156-166
作者:
Zhang, LJ
;
Chen, ZY
;
Hu, QM
;
Yang, R
;
Hu, QM (reprint author), Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, 72 Wenhua Rd, Shenyang 110016, Liaoning, Peoples R China.
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浏览/下载：44/0
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提交时间：2018/06/05
Grain-boundary Segregation
Austenitic Stainless-steel
Total-energy Calculations
Augmented-wave Method
Elastic Band Method
Alloying Elements
Self-diffusion
Impurity Diffusion
1st Principles
Saddle-points
The diffusion barrier effect of Fe-Ni UBM as compared to the commercial Cu UBM during high temperature storage
期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2018, 卷号: 739, 页码: 632-642
作者:
Gao, LY
;
Li, CF
;
Wan, P
;
Zhang, H
;
Liu, ZQ
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|
浏览/下载：24/0
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提交时间：2018/06/05
Lead-free Solders
Interfacial Reactions
Sn-ag
Intermetallic Compounds
Rich Solders
Joints
Growth
Reliability
Substrate
Strength
Failure Mechanisms of SAC/Fe-Ni Solder Joints During Thermal Cycling
期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2017, 卷号: 46, 期号: 8, 页码: 5338-5348
Gao, Li-Yin
;
Liu, Zhi-Quan
;
Li, Cai-Fu
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浏览/下载：34/0
|
提交时间：2017/08/17
Fe-Ni under bump metallization (UBM)
thermal cycling
microstructural evolution
lifetime
recrystallization
electron backscatter diffraction (EBSD)
A superior interfacial reliability of Fe-Ni UBM during high temperature storage
期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2017, 卷号: 28, 期号: 12, 页码: 8537-8545
Gao, Li-Yin
;
Li, Cai-Fu
;
Wan, Peng
;
Liu, Zhi-Quan
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浏览/下载：22/0
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提交时间：2017/08/17
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