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Intermetallic compounds evolution between lead-free solder and cu-based lead frame alloys during isothermal aging 期刊论文
JOURNAL OF MATERIALS SCIENCE, 2006, 卷号: 41, 期号: 8, 页码: 2359-2364
Xia, YH; Xie, XM; Xie, XM; Lu, CY
收藏  |  浏览/下载:24/0  |  提交时间:2012/03/24
Effect of film thickness on preferred growth of TiN films during filtered arc deposition 期刊论文
JOURNAL OF MATERIALS SCIENCE LETTERS, 1997, 卷号: 16, 期号: 12, 页码: 974-976
Zhao, JP; Wang, X; Chen, ZY; Yang, SQ; Shi, TS; Liu, X
收藏  |  浏览/下载:8/0  |  提交时间:2012/03/25
MICROSTRUCTURE OF TIN FILMS AND INTERFACES FORMED BY ION-BEAM-ENHANCED DEPOSITION AND SIMPLE PHYSICAL VAPOR-DEPOSITION 期刊论文
JOURNAL OF MATERIALS RESEARCH, 1995, 卷号: 10, 期号: 4, 页码: 995-999
CHENG, ZY; ZHU, J; LIU, XH; WANG, X; YANG, GQ
收藏  |  浏览/下载:7/0  |  提交时间:2012/03/25


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