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Microstructure evolution and strengthening mechanisms of Al0.4CoCu0.6NiSix (x=0-0.2) high entropy alloys prepared by vacuum arc melting and copper injection fast solidification 期刊论文
VACUUM, 2018, 卷号: 150, 页码: 84-95
作者:  Chen, YX;  Zhu, S;  Wang, XM;  Yang, BJ;  Han, GF
收藏  |  浏览/下载:16/0  |  提交时间:2018/06/05
Failure behavior of flip chip solder joint under coupling condition of thermal cycling and electrical current 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2018, 卷号: 29, 期号: 6, 页码: 5025-5033
作者:  Zhu, QS;  Gao, F;  Ma, HC;  Liu, ZQ;  Guo, JD
收藏  |  浏览/下载:20/0  |  提交时间:2018/06/05
Effect of Cr3C2 content on 316L stainless steel fabricated by laser melting deposition 期刊论文
VACUUM, 2018, 卷号: 147, 页码: 92-98
作者:  Wang, S;  Zhang, S;  Zhang, CH;  Wu, CL;  Chen, J
收藏  |  浏览/下载:13/0  |  提交时间:2018/06/05
Coercivity enhancement and microstructural optimization in diffusion-processed Ce-Nd-Fe-B-based films 期刊论文
THIN SOLID FILMS, 2018, 卷号: 645, 页码: 1-4
作者:  Cui, WB;  Zhang, TB;  Zhou, XQ;  Wang, Q;  Zhao, XG
收藏  |  浏览/下载:15/0  |  提交时间:2018/06/05
Failure Mechanisms of SAC/Fe-Ni Solder Joints During Thermal Cycling 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2017, 卷号: 46, 期号: 8, 页码: 5338-5348
Gao, Li-Yin; Liu, Zhi-Quan; Li, Cai-Fu
收藏  |  浏览/下载:34/0  |  提交时间:2017/08/17
Microstructure evolution and EBSD analysis of a graded steel fabricated by laser additive manufacturing 期刊论文
VACUUM, 2017, 卷号: 141, 页码: 68-81
Wang, Qiang; Zhang, Song; Zhang, ChunHua; Wu, Chenliang; Wang, Jianqiang; Chen, Jiang; Sun, Zulai
收藏  |  浏览/下载:29/0  |  提交时间:2017/08/17


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