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Understanding Interlayer Coupling in TMD-hBN Heterostructure by Raman Spectroscopy 期刊论文
IEEE TRANSACTIONS ON ELECTRON DEVICES, 2018, 卷号: 65, 期号: 10, 页码: 4059-4067
作者:  Ding, L;  Ukhtary, MS;  Chubarov, M;  Choudhury, TH;  Zhang, F
收藏  |  浏览/下载:28/0  |  提交时间:2018/12/25
Application of CTLM method combining interfacial structure characterization to investigate contact formation of silver paste metallization on crystalline silicon solar cells 期刊论文
SOLID-STATE ELECTRONICS, 2018, 卷号: 142, 页码: 1, 7
作者:  Xiong, Shenghu;  Yuan, Xiao;  Tong, Hua;  Yang, Yunxia;  Liu, Cui
收藏  |  浏览/下载:42/0  |  提交时间:2018/12/28


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