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Recent progresses of Si-based photonics in chinese main land 期刊论文
ieice transactions on electronics, 2008, 卷号: e91c, 期号: 2, 页码: 150-155
Yu JZ; Wang QM; Chenw BW; Chen SW; Zuo YH
收藏  |  浏览/下载：60/3  |  提交时间：2010/03/08
Characteristics of SOI rib waveguide microring and racetrack resonators 会议论文
5th ieee international conference on group iv photonics, sorrento, italy, sep 17-19, 2008
Huang, QZ; Xiao, X; Li, YT; Yu, YD; Yu, JZ
收藏  |  浏览/下载：61/0  |  提交时间：2010/03/09
Characterization of parasitics in TO-packaged high-speed laser modules 期刊论文
ieee transactions on advanced packaging, 2007, 卷号: 30, 期号: 1, 页码: 97-103
Chen C (Chen Cheng); Zhu NH (Zhu Ning Hua); Zhang SJ (Zhang Shang Jian); Liu Y (Liu Yu)
收藏  |  浏览/下载：20/0  |  提交时间：2010/03/29
Investigation of a chemically treated InP(100) surface during hydrophilic wafer bonding process 期刊论文
materials science and engineering b-solid state materials for advanced technology, 2006, 卷号: 128, 期号: 1-3, 页码: 93-97
作者:  Yu LJ
收藏  |  浏览/下载：66/0  |  提交时间：2010/04/11
SHicon-based resonant-cavity-enhanced photodetectors 会议论文
3rd international conference on group iv photonics, ottawa, canada, sep 13-15, 2006
Cheng BW (Cheng Buwen); Li CB (Li Chuanbo); Mao RW (Mao Rongwei); Yao F (Yao Fei); Xue CL (Xue Chunlai); Zhang JG (Zhang Jianguo); Shi WH (Shi Wenhua); Zuo YH (Zuo Yuhua); Yu JZ (Yu Jinzhong); Wang QM (Wang Qiming)
收藏  |  浏览/下载：72/9  |  提交时间：2010/03/29
Bonding-wire compensation effect on the packaging parasitics of optoelectronic devices 期刊论文
microwave and optical technology letters, 2006, 卷号: 48, 期号: 1, 页码: 76-79
Zhu NH; Liu Y; Zhang SJ; Wen JM
收藏  |  浏览/下载：46/0  |  提交时间：2010/04/11
Thermal stress analysis for GaInAsP multiple quantum well wafer chemically bonded to Si (100) 期刊论文
journal of applied physics, 2006, 卷号: 100, 期号: 2, 页码: art.no.023513
Zhao HQ (Zhao Hong-Quan); Yu LJ (Yu Li-Juan); Huang YZ (Huang Yong-Zhen)
收藏  |  浏览/下载：32/0  |  提交时间：2010/04/11
Analysis of Si/GaAs Bonding Stresses with the Finite Element Method 期刊论文
半导体学报, 2006, 卷号: 27, 期号: 11, 页码: 1906-1910
作者:  Cao Yulian;  Chen Lianghui;  Wu Xuming
收藏  |  浏览/下载：19/0  |  提交时间：2010/11/23
Strain analysis of InP/InGaAsP wafer bonded on Si by X-ray double crystalline diffraction 期刊论文
materials science and engineering b-solid state materials for advanced technology, 2006, 卷号: 133, 期号: 1-3, 页码: 117-123
Zhao HQ (Zhao Hong-Quan); Yu LJ (Yu Li-Juan); Huang YZ (Huang Yong-Zhen); Wang YT (Wang Yu-Tian)
收藏  |  浏览/下载：31/0  |  提交时间：2010/04/11
Frequency bandwidth estimation of TO packaging techniques for laser modules 期刊论文
optical and quantum electronics, 2005, 卷号: 37, 期号: 10, 页码: 903-913
Zhu, NH; Wang, YL; Qian, C; Pun, EYB; Chung, PS
收藏  |  浏览/下载：126/33  |  提交时间：2010/03/17

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