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A Single Mode Hybrid III–V/Silicon On-Chip Laser Based on Flip-Chip Bonding Technology for Optical Interconnection 期刊论文
Chinese Physics Letters, 2016, 卷号: 33, 期号: 12, 页码: 124207
Hai-Ling Wang; Wan-Hua Zheng
收藏  |  浏览/下载:16/0  |  提交时间:2017/03/16
Recent progresses of Si-based photonics in chinese main land 期刊论文
ieice transactions on electronics, 2008, 卷号: e91c, 期号: 2, 页码: 150-155
Yu JZ; Wang QM; Chenw BW; Chen SW; Zuo YH
收藏  |  浏览/下载:60/3  |  提交时间:2010/03/08
Flip-chip bonded hybrid CMOS/SEED optoelectronic smart pixels 期刊论文
iee proceedings-optoelectronics, 2000, 卷号: 147, 期号: 1, 页码: 2-6
Chen HD; Liang K; Zeng QM; Li XJ; Chen ZB; Du Y; Wu RH
收藏  |  浏览/下载:46/0  |  提交时间:2010/08/12


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