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CORC

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Vertical Strain Engineering of Epitaxial La2/3Sr1/3MnO3 Thin Films by Spontaneously Embedding ZrO2 Nanopillar Arrays 期刊论文
ADVANCED MATERIALS INTERFACES, 2020
作者:  Cao, Guixin;  Song, Kepeng;  Qiao, Liang;  Guo, Junjie;  Han, Weihua
收藏  |  浏览/下载：27/0  |  提交时间：2021/02/03
Dynamic constitutive model of frozen soil that considers the evolution of volume fraction of ice 期刊论文
SCIENTIFIC REPORTS, 2020, 卷号: 10, 期号: 1, 页码: 20941
作者:  Xie, Qijun;  Su, Lijun;  Zhu, Zhiwu
收藏  |  浏览/下载：21/0  |  提交时间：2021/03/01
Laboratory investigation into effect of bolt profiles on shear behaviors of bolt-grout interface under constant normal stiffness (CNS) conditions 期刊论文
JOURNAL OF ROCK MECHANICS AND GEOTECHNICAL ENGINEERING, 2020, 卷号: 12, 期号: 6, 页码: 1234-1248
作者:  Cui, Guojian;  Zhang, Chuanqing;  Pan, Yibin;  Deng, Liang;  Zhou, Hui
收藏  |  浏览/下载：22/0  |  提交时间：2021/05/25
Enhancing the dynamic temperature stability of epoxy with graphene oxide 期刊论文
MECHANICS OF MATERIALS, 2020, 卷号: 150, 页码: 103593
作者:  Qiao Y(乔宇);  Wang PF;  Xue X;  Liu M;  Xu SL
收藏  |  浏览/下载：95/0  |  提交时间：2020/12/28
High performance and low thermal expansion in Er-Fe-V-Mo dual-phase alloys 期刊论文
ACTA MATERIALIA, 2020, 卷号: 198, 页码: 271-280
作者:  Lin, Kun;  Li, Wenjie;  Yu, Chengyi;  Jiang, Suihe;  Cao, Yili
收藏  |  浏览/下载：25/0  |  提交时间：2021/02/02
High performance and low thermal expansion in Er-Fe-V-Mo dual-phase alloys 期刊论文
ACTA MATERIALIA, 2020, 卷号: 198, 页码: 271-280
作者:  Lin, Kun;  Li, Wenjie;  Yu, Chengyi;  Jiang, Suihe;  Cao, Yili
收藏  |  浏览/下载：18/0  |  提交时间：2021/02/02
Deposition of highly adhesive nanocrystalline diamond films on Ti substrates via diamond/SiC composite interlayers 期刊论文
DIAMOND AND RELATED MATERIALS, 2020, 卷号: 108, 页码: 10
作者:  Yang, Bing;  Li, Haining;  Yu, Biao;  Huang, Nan;  Liu, Lusheng
收藏  |  浏览/下载：17/0  |  提交时间：2021/02/02
Failure Mechanism of the SnAgCu/SnPb Mixed Soldering Process in a Ball Grid Array Structure 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2020, 页码: 9
作者:  Gao, Li-Yin;  Cui, Xian-Wei;  Tian, Fei-Fei;  Liu, Zhi-Quan
收藏  |  浏览/下载：46/0  |  提交时间：2021/02/02
Failure Mechanism of the SnAgCu/SnPb Mixed Soldering Process in a Ball Grid Array Structure 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2020, 页码: 9
作者:  Gao, Li-Yin;  Cui, Xian-Wei;  Tian, Fei-Fei;  Liu, Zhi-Quan
收藏  |  浏览/下载：42/0  |  提交时间：2021/02/02
The open-pin failure of power device under the combined effect of thermo-migration and electro-migration 期刊论文
Chinese Science Bulletin, 2020, 卷号: 65, 期号: 20, 页码: 2169-2177
作者:  Gao Liyin;  Li Caifu;  Cao Lihua;  Liu Zhiquan
收藏  |  浏览/下载：15/0  |  提交时间：2021/02/03

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