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浏览/检索结果: 共3条，第1-3条 帮助 限定条件 发表日期：2020     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Failure Mechanism of the SnAgCu/SnPb Mixed Soldering Process in a Ball Grid Array Structure 期刊论文 JOURNAL OF ELECTRONIC MATERIALS, 2020, 页码: 9 作者:  Gao, Li-Yin;  Cui, Xian-Wei;  Tian, Fei-Fei;  Liu, Zhi-Quan 收藏  |  浏览/下载：46/0  |  提交时间：2021/02/02 Mixed soldering  ball grid array  solidification  crack  shrinkage  failure mechanism   Failure Mechanism of the SnAgCu/SnPb Mixed Soldering Process in a Ball Grid Array Structure 期刊论文 JOURNAL OF ELECTRONIC MATERIALS, 2020, 页码: 9 作者:  Gao, Li-Yin;  Cui, Xian-Wei;  Tian, Fei-Fei;  Liu, Zhi-Quan 收藏  |  浏览/下载：42/0  |  提交时间：2021/02/02 Mixed soldering  ball grid array  solidification  crack  shrinkage  failure mechanism   Wetting of Ni-based amorphous and crystalline alloys by Sn and Sn-based solders 期刊论文 Microelectronics Reliability, 2020, 卷号: 111 作者:  Lin, Qiaoli;  Ye, Changsheng;  Sui, Ran 收藏  |  浏览/下载：3/0  |  提交时间：2020/11/14 Amorphous alloys  Binary alloys  Copper alloys  Lead alloys  Nickel oxide  Oxide films  Silver alloys  Ternary alloys  Tin  Crystalline alloys  Interfacial reactivity  Minimum surfaces  Primary crystallization  Sn-based solders  Volume shrinkage  Wetting balance methods  Wetting mechanism