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CORC

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Are Cu2Te-Based Compounds Excellent Thermoelectric Materials? 期刊论文
ADVANCED MATERIALS, 2019, 卷号: 31, 期号: 49
作者:  Zhao, Kunpeng;  Liu, Ke;  Yue, Zhongmou;  Wang, Yancheng;  Song, Qingfeng
收藏  |  浏览/下载：155/0  |  提交时间：2019/12/31
Rapid growth of large-area single-crystal graphene film by seamless stitching using resolidified copper foil on a molybdenum substrate 期刊论文
JOURNAL OF MATERIALS CHEMISTRY A, 2019, 卷号: 7, 期号: 31, 页码: 18373
作者:  Cheng, Yuan;  Bi, Hui;  Che, Xiangli;  Zhao, Wei;  Li, Dezeng
收藏  |  浏览/下载：59/0  |  提交时间：2019/12/26
Asymmetric cyclic response of tensile pre-deformed Cu with highly oriented nanoscale twins 期刊论文
ACTA MATERIALIA, 2019, 卷号: 175, 页码: 477-486
作者:  Pan, Qingsong;  Zhou, Haofei;  Lu, Qiuhong;  Gao, Huajian;  Lu, Lei
收藏  |  浏览/下载：54/0  |  提交时间：2021/02/02
Adlayer-Free Large-Area Single Crystal Graphene Grown on a Cu(111) Foil 期刊论文
ADVANCED MATERIALS, 2019, 卷号: 31, 期号: 35, 页码: 13
作者:  Luo, Da;  Wang, Meihui;  Li, Yunqing;  Kim, Changsik;  Yu, Ka Man
收藏  |  浏览/下载：89/0  |  提交时间：2019/12/03
Hydrothermal growth and their optoelectronic device application of Cul nanostructure 期刊论文
MATERIALS RESEARCH EXPRESS, 2019, 卷号: 6, 期号: 4
作者:  Li, Zhigang;  Zhang, Lichun;  Wang, Jianbu;  Yang, Lixin;  Xin, Lianjie
收藏  |  浏览/下载：29/0  |  提交时间：2019/08/19
Hydrothermal growth and their optoelectronic device application of Cul nanostructure 期刊论文
MATERIALS RESEARCH EXPRESS, 2019, 卷号: 6, 期号: 4
作者:  Li, Zhigang;  Zhang, Lichun;  Wang, Jianbu;  Yang, Lixin;  Xin, Lianjie
收藏  |  浏览/下载：21/0  |  提交时间：2019/03/13
High-Temperature Structural and Thermoelectric Study,of Argyrodite Ag8GeSe6 期刊论文
ACS APPLIED MATERIALS & INTERFACES, 2019, 卷号: 11, 期号: 2, 页码: 2168-2176
作者:  Shen, Xingchen;  Yang, Chun-Chuen;  Liu, Yamei;  Wang, Guiwen;  Tan, Huan
收藏  |  浏览/下载：61/0  |  提交时间：2019/03/01
Thermoelectric properties of n-type CuxBi2S3 materials fabricated by plasma activated sintering 期刊论文
Journal of Alloys and Compounds, 2019, 卷号: 780, 页码: 35-40
作者:  Yang, Jian;  Yu, Liuxu;  Wang, Tingting;  Yan, Junnan;  Liu, Guiwu
收藏  |  浏览/下载：13/0  |  提交时间：2019/11/19
Effect of polycrystalline Cu microstructures on IMC growth behavior at Sn/Cu soldering interface 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 页码: 15964-15971
作者:  Zhu, Zhidan;  Ma, Haoran;  Shang, Shengyan;  Ma, Haitao;  Wang, Yunpeng
收藏  |  浏览/下载：7/0  |  提交时间：2019/12/02
High-Temperature Structural and Thermoelectric Study of Argyrodite Ag8GeSe6 期刊论文
ACS Applied Materials and Interfaces, 2019, 卷号: 11, 期号: 2, 页码: 2168-2176
作者:  Shen, Xingchen;  Yang, Chun-Chuen;  Liu, Yamei;  Wang, Guiwen;  Tan, Huan
收藏  |  浏览/下载：2/0  |  提交时间：2020/02/18

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