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The Measurement of Optical Interconnect Module Postsoldering Alignment Offsets and the Study of Its Influence on Optical Coupling Efficiency 期刊论文
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2019, 卷号: Vol.9 No.2, 页码: 380-387
作者:  Huang, Chunyue;  Lu, Liangkun;  Shao, Liangbin;  Liang, Ying
收藏  |  浏览/下载:5/0  |  提交时间:2019/12/13
Enhancement of the mechanical strength of Sn-3.0Ag-0.5Cu/Ni joints via doping minor Ni into solder alloy. 期刊论文
Materials Letters, 2019, 卷号: Vol.235, 页码: 180-183
作者:  Chou, Tzu-Ting;  Song, Rui-Wen;  Chen, Wei-Yu;  Duh, Jenq-Gong
收藏  |  浏览/下载:14/0  |  提交时间:2019/12/17


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