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Effect of Cryogenic Treatment on Extruded Copper Structures 会议论文
Jiaozuo, China, September 20, 2019 - September 22, 2019
作者:  Shengquan, Zhang;  Bing, Wang;  Shizhuo, Wang;  Changzhong, Zhao;  Xijing, Wang
收藏  |  浏览/下载:2/0  |  提交时间:2020/11/15
PVD Depostion of Nb3Sn Thin Film on Copper Substrate from an Alloy Nb3Sn Target 会议论文
Australia, 2019
作者:  R. Valizadeh;  S. Aliasghari;  A.N. Hannah;  O.B. Malyshev
收藏  |  浏览/下载:13/0  |  提交时间:2019/08/06
Simulation of Electric and Thermal Behavior of Cryogenic Three-cell Copper Accelerating Cavity for High Gradient Experiments 会议论文
Australia, 2019
作者:  T. Tanaka;  K. Hayakawa;  Y. Hayakawa;  K. Nogami;  T. Sakai
收藏  |  浏览/下载:30/0  |  提交时间:2019/08/06
Novel Technique Ion Assisted In-Situ Coating of Long, Small Diameter, Accelerator Beam Pipes with Compacted Thick Crystalline Copper Film 会议论文
Australia, 2019
作者:  A. Hershcovitch;  M. Blaskiewicz;  J.M. Brennan;  W. Fischer;  G.T. McIntyre
收藏  |  浏览/下载:21/0  |  提交时间:2019/08/06
Copper-catalyzed asymmetric silylative cyclization of cyclohexadienone-containing 1,6-enynes 会议论文
作者:  Lin, Guo-Qiang;  Tian, Ping;  He, Cheng-Yu;  Xie, Li -Bo;  Ding, Rui
收藏  |  浏览/下载:4/0  |  提交时间:2019/12/05
Performance of Copper Oscillating Heat Pipes with Grass-like Nanowire Superhydrophilic Surface in Horizontal Mode 会议论文
International Symposium on Oscillating/Pulsating Heat Pipes (ISOPHP 2019)
作者:  Yu HW(于慧文);  Hao TT(郝婷婷);  Ma XH(马学虎);  Lan Z(兰忠)
收藏  |  浏览/下载:7/0  |  提交时间:2019/12/02
Droplet impact dynamics on patterned copper-nanowire superhydrophobic cooling surfaces 会议论文
6th ASME Micro/Nanoscale Heat and Mass Transfer conference (MNHMT2019)
作者:  Yang SY(杨思艳);  Ma XH(马学虎);  Hao TT(郝婷婷)
收藏  |  浏览/下载:7/0  |  提交时间:2019/12/02
Double-sided lapping of thin copper substrate by textured fixed-abrasive pad 会议论文
19th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2019, Bilbao, Spain, 2019-06-03
作者:  Pan, Bo;  Kang, Renke;  Fu, Haiyang;  Zhu, Xianglong;  Guo, Jiang
收藏  |  浏览/下载:10/0  |  提交时间:2019/12/02
The effect of copper vapour on fault arc in hybrid DC circuit breaker 会议论文
14th IEEE Conference on Industrial Electronics and Applications, ICIEA 2019, 2 Huzhu Road, Xi'an, China, 2019-06-19
作者:  Li, Mei;  Guo, Pengcheng;  Zhao, Daoli;  Wu, Yifei;  Wu, Yi
收藏  |  浏览/下载:5/0  |  提交时间:2019/12/20
Study on engaging characteristics of wet friction pair with copper-based powder metallurgical friction material 会议论文
7TH GLOBAL CONFERENCE ON MATERIALS SCIENCE AND ENGINEERING (CMSE2018), 2019-01-01
作者:  Wang, Y. Z.;  Ren, S. Y.;  Li, Y.;  Zhang, W.;  Chu, X. M.
收藏  |  浏览/下载:10/0  |  提交时间:2019/12/30


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