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浏览/检索结果: 共6条，第1-6条 帮助 限定条件 发表日期：2019    内容类型：会议论文    专题：西安理工大学    第一署名单位    第一作者单位    通讯作者单位     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Study on K0 Characteristics of Unsaturated Loess under Isotropic Stress Path 会议论文 3rd International Symposium on Resource Exploration and Environmental Science, REES 2019, Ordos, China, 2019-04-27 作者:  Jia, Yajun;  Chen, Cunli;  Liu, Naijun 收藏  |  浏览/下载：6/0  |  提交时间：2019/12/20 Consolidation and Pore Pressure Characteristics of Remolded Unsaturated Loess under Isotropic Stress 会议论文 3rd International Symposium on Resource Exploration and Environmental Science, REES 2019, Ordos, China, 2019-04-27 作者:  Jia, Yajun;  Chen, Cunli;  Zhang, Dengfei 收藏  |  浏览/下载：3/0  |  提交时间：2019/12/20 Effect of thermal stress on the electrical properties of TSV inductor 会议论文 2019 IEEE INTERNATIONAL CONFERENCE ON ELECTRON DEVICES AND SOLID-STATE CIRCUITS (EDSSC), 2019-01-01 作者:  Wang, Fengjuan;  Liu, Jingting;  Yu, Ningmei 收藏  |  浏览/下载：11/0  |  提交时间：2019/12/20 thermal stress  TSV inductor  silicon substrate resistivity  electrical properties   An Effective Method of Reducing TSV Thermal Stress by STI 会议论文 2019 IEEE INTERNATIONAL CONFERENCE ON ELECTRON DEVICES AND SOLID-STATE CIRCUITS (EDSSC), 2019-01-01 作者:  Wang, Fengjuan;  Qu, Xiaoqing;  Yu, Ningmei 收藏  |  浏览/下载：4/0  |  提交时间：2019/12/20 Keywords Three-dimensional integrated circuits (3-D IC)  through-silicon via (TSV)  shallow trench isolation (STI)  thermal stress  keep-out zone (KOZ)   Load and Stress Distribution of Thread Pair and Analysis of Influence Factors 会议论文 2018 INTERNATIONAL SYMPOSIUM ON POWER ELECTRONICS AND CONTROL ENGINEERING (ISPECE 2018), 2019-01-01 作者:  Lu, Shikun;  Hua, Dengxin;  Li, Yan;  Cui, Fang Yuan;  Li, Pengyang 收藏  |  浏览/下载：10/0  |  提交时间：2019/12/20 Interfacial Stress Between Conductor and Insulation material of GIS/GIL Spacer Used in UHV 会议论文 2019 2ND INTERNATIONAL CONFERENCE ON ELECTRICAL MATERIALS AND POWER EQUIPMENT (ICEMPE 2019), 2019-01-01 作者:  An, Yuan;  Wang, Chuang;  Zhao, Lang;  Jia, Jing;  Sun, Qing 收藏  |  浏览/下载：7/0  |  提交时间：2019/12/20 interfacial stress  GIS/GIL spacer  hydrostatic test