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The surface energy and stress of metals 期刊论文
SURFACE SCIENCE, 2018, 卷号: 674, 页码: 51-68
作者:  Lee, JY;  Punkkinen, MPJ;  Schonecker, S;  Nabi, Z;  Kadas, K
收藏  |  浏览/下载:20/0  |  提交时间:2018/12/25
Failure behavior of flip chip solder joint under coupling condition of thermal cycling and electrical current 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2018, 卷号: 29, 期号: 6, 页码: 5025-5033
作者:  Zhu, QS;  Gao, F;  Ma, HC;  Liu, ZQ;  Guo, JD
收藏  |  浏览/下载:20/0  |  提交时间:2018/06/05


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