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ELL公司创业计划书 学位论文
2017, 2016
林颖
收藏  |  浏览/下载:4/0  |  提交时间:2017/06/20
Finite Element Analysis of Bond Line Thickness and Fiber Distribution in Solder Based Thermal Interface Materials 会议论文
2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01
作者:  Satwara, Maulik[1];  Hansson, Josef[2];  Ye, Lilei[3];  Rhedin, Henric[4];  Liu, Johan[5]
收藏  |  浏览/下载:4/0  |  提交时间:2019/04/24
Fabrication and Characterization of a Carbon Fiber Solder Composite Thermal Interface Material 会议论文
2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01
作者:  Hansson, Josef[1];  Ye, Lilei[2];  Liu, Johan[3]
收藏  |  浏览/下载:3/0  |  提交时间:2019/04/24
Current status and progress of organic functionalization of CNT based thermal interface materials for electronics cooling applications 会议论文
2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01
作者:  Nylander, Andreas[1];  Fu, Yifeng[2];  Ye, Lilei[3];  Liu, Johan[4]
收藏  |  浏览/下载:27/0  |  提交时间:2019/04/24
Hydrothermal Synthesis of VO2 Polymorphs: Advantages, Challenges and Prospects for the Application of Energy Efficient Smart Windows 期刊论文
SMALL, 2017, 卷号: 13
作者:  Li, Ming[1];  Magdassi, Shlomo[2];  Gao, Yanfeng[3];  Long, Yi[4]
收藏  |  浏览/下载:3/0  |  提交时间:2019/04/24


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