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大连理工大学 [12]
湖南大学 [11]
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期刊论文 [28]
会议论文 [1]
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2017 [29]
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Development of 1032 mm optical window for shipboard photoelectric tracking system
期刊论文
Guangxue Jingmi Gongcheng/Optics and Precision Engineering, 2017, 卷号: 25, 期号: 9
作者:
Yang, L.-B.
;
Y.-H. Li
;
Y.-B. Cao
;
Y. Chen
;
J.-J. Xie
收藏
  |  
浏览/下载:20/0
  |  
提交时间:2018/06/13
Rotary ultrasonic face grinding of carbon fiber reinforced plastic (CFRP): a study on cutting force model
期刊论文
International Journal of Advanced Manufacturing Technology, 2017, 卷号: 89, 期号: 1-4, 页码: 847-856
作者:
Liu, Shuliang
;
Chen, Tao*
;
Wu, Chaoqun
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  |  
浏览/下载:2/0
  |  
提交时间:2019/12/04
Carbon fiber reinforced plastic (CFRP)
Cutting force
Face grinding
Material removal mechanism
Rotary ultrasonic machining (RUM)
Study on the Surface Damage Layer in Multiple Grinding of Quartz Glass by Molecular Dynamics Simulation
期刊论文
JOURNAL OF NANO RESEARCH, 2017, 卷号: 46, 页码: 192-202
作者:
Liu, Tao
;
Guo, Xiaoguang
;
Li, Qiang
;
Kang, Renke
;
Guo, Dongming
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2019/12/02
Multiple grinding
Molecular dynamics
Densification
Nanoindentation hardness
Damage layer
Surface integrity and removal mechanism in grinding sapphire wafers with novel vitrified bond diamond plates
期刊论文
MATERIALS AND MANUFACTURING PROCESSES, 2017, 卷号: 32, 页码: 121-126
作者:
Gao, Shang
;
Kang, Ren-Ke
;
Dong, Zhi-Gang
;
Zhang, Bi
;
Wang, Zi-Guang
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2019/12/02
Damage
diamond
efficiency
grinding
mechanism
removal
sapphire
subsurface
surface
topography
wafer
Residual Stress Distribution in Silicon Wafers Machined by Rotational Grinding
期刊论文
JOURNAL OF MANUFACTURING SCIENCE AND ENGINEERING-TRANSACTIONS OF THE ASME, 2017, 卷号: 139
作者:
Zhou, Ping
;
Yan, Ying
;
Huang, Ning
;
Wang, Ziguang
;
Kang, Renke
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2019/12/02
grinding
subsurface damage
silicon
residual stress
load identification
A novel approach of high-performance grinding using developed diamond wheels
期刊论文
INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY, 2017, 卷号: 91, 页码: 3315-3326
作者:
Zhang, Zhenyu
;
Huang, Siling
;
Wang, Shaochen
;
Wang, Bo
;
Bai, Qian
收藏
  |  
浏览/下载:11/0
  |  
提交时间:2019/12/02
Si wafer
Diamond wheel
CeO2
Amorphous layer
Transmission electron microscopy
A methodology for helical mill-grinding of tiny internal threads made of hard brittle materials
期刊论文
INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY, 2017, 卷号: 91, 页码: 25-37
作者:
Gao, Hang
;
Lu, Shouxiang
;
Yang, Anqiang
;
Bao, Yongjie
收藏
  |  
浏览/下载:4/0
  |  
提交时间:2019/12/02
Internal threadmachining
Helical mill-grinding
Principle error
SiCp/Al composite
Surface integrity and removal mechanism of silicon wafers in chemo-mechanical grinding using a newly developed soft abrasive grinding wheel
期刊论文
MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING, 2017, 卷号: 63, 页码: 97-106
作者:
Gao, Shang
;
Huang, Han
;
Zhu, Xianglong
;
Kang, Renke
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2019/12/02
Silicon wafer
Chemo-mechanical grinding
Soft abrasive
Surface finish
Subsurface damage
Improvement of gear pitch machining accuracy based on the principle of phase-transfer gear-grinding technique
会议论文
PROCEEDINGS OF THE 2017 3RD INTERNATIONAL FORUM ON ENERGY, ENVIRONMENT SCIENCE AND MATERIALS (IFEESM 2017), 2017-01-01
作者:
Ling, Siying
;
Wang, Kun
;
Yu, Baodi
;
Wang, Xiaodong
;
Wang, Liding
收藏
  |  
浏览/下载:6/0
  |  
提交时间:2019/12/03
Phase transfer
lndexing error
Pitch deviation
Gear grinding Technology
Characterization of material removal in ultrasonically assisted grinding of SiCp/Al with high volume fraction
期刊论文
INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY, 2017, 卷号: 93, 页码: 2827-2839
作者:
Dong, Zhigang
;
Zheng, Feifei
;
Zhu, Xianglong
;
Kang, Renke
;
Zhang, Bi
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2019/12/03
SiCp/Al
Ultrasonically assisted grinding
Conventional grinding
Subsurface damage
Grinding forces
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