CORC

在结果中检索

CORC

浏览/检索结果: 共96条，第1-10条 帮助

限定条件    
已选(0)清除 条数/页：   排序方式：
Structural, electronic, and thermodynamic properties of curium dioxide: density functional theory calculations 期刊论文
Physical review b, 2017, 卷号: 96, 期号: 23, 页码: 13
作者:  Hou, Ling;  Li, Wei-Dong;  Wang, Fangwei;  Eriksson, Olle;  Wang, Bao-Tian
收藏  |  浏览/下载：33/0  |  提交时间：2019/04/23
Comparative Study of Thermal Shock Behavior of the Arc Ion Plating NiCrAlY and the Enamel Based Composite Coatings 期刊论文
ACTA METALLURGICA SINICA, 2017, 卷号: 53, 期号: 12, 页码: 1636-1644
作者:  Feng Min;  Chen Minghui;  Yu Zhongdi;  Lv Zhenbo;  Zhu Shenglong
收藏  |  浏览/下载：19/0  |  提交时间：2021/02/02
High-Si reinforced Al matrix composites prepared by powder semi-solid squeeze 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2017, 卷号: 726, 期号: 无, 页码: 772-778
作者:  Liu, Junwu;  Zhou, Xingxing;  Xin, Hongxing
收藏  |  浏览/下载：221/0  |  提交时间：2018/08/17
Structure, electronic element module, heat exchanger, fuel rod, and fuel assembly 专利
专利号: US9793011, 申请日期: 2017-10-17, 公开日期: 2017-10-17
作者:  ISHIBASHI, RYOU;  NAITOU, TAKASHI;  KODAMA, MOTOMUNE;  AOYAGI, TAKUYA;  HINO, TETSUSHI
收藏  |  浏览/下载：23/0  |  提交时间：2019/12/24
Heat-dissipating substrate and method for manufacturing same 专利
专利号: EP3229268A1, 申请日期: 2017-10-11, 公开日期: 2017-10-11
作者:  FUKUI, AKIRA
收藏  |  浏览/下载：11/0  |  提交时间：2019/12/30
Ultra-low thermal expansion realized in giant negative thermal expansion materials through self-compensation 期刊论文
APL MATERIALS, 2017, 卷号: 5, 期号: 10, 页码: 8
作者:  Shen, Fei-Ran;  Kuang, Hao;  Hu, Feng-Xia;  Wu, Hui;  Huang, Qing-Zhen
收藏  |  浏览/下载：25/0  |  提交时间：2019/06/17
Comparison of Acoustic Emission Characteristics for C/SiC Composite Component Under Combination of Heating and Mechanical Loading 期刊论文
CHINESE ACAD SCIENCES, INST METAL RESEARCH, 2017, 卷号: 30, 期号: 10, 页码: 992-998
作者:  Tan, Zhi-Yong;  Min, Chang-Wan;  Wu, Hong-Wei;  Qian, Yu-Hai;  Li, Mei-Shuan
收藏  |  浏览/下载：30/0  |  提交时间：2018/01/10
Transport properties of MnTe films with cracks produced in thermal cycling process 期刊论文
SPRINGER, 2017, 卷号: 123, 期号: 10, 页码: -
作者:  Yang, Liang;  Wang, Zhenhua;  Zhang, Zhidong;  Wang, ZH (reprint author), Univ Chinese Acad Sci, Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, 72 Wenhua Rd, Shenyang 110016, Liaoning, Peoples R China.
收藏  |  浏览/下载：14/0  |  提交时间：2018/01/10
Thermal Stress and Smile of Conduction-cooled High Power Semiconductor Laser Arrays 期刊论文
Guangzi Xuebao/Acta Photonica Sinica, 2017, 卷号: 46, 期号: 9
作者:  Lu, Yao;  Nie, Zhi-Qiang;  Chen, Tian-Qi;  Zhang, Pu;  Xiong, Ling-Ling
收藏  |  浏览/下载：20/0  |  提交时间：2017/12/30
Failure Mechanisms of SAC/Fe-Ni Solder Joints During Thermal Cycling 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2017, 卷号: 46, 期号: 8, 页码: 5338-5348
Gao, Li-Yin; Liu, Zhi-Quan; Li, Cai-Fu
收藏  |  浏览/下载：34/0  |  提交时间：2017/08/17

©版权所有 ©2017 CSpace - Powered by CSpace