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CORC

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Hierarchically Interconnected Epoxy/BN-SCMC Polymer Composites with Enhanced Thermal Conductivity 会议论文
Harbin, China
作者:  Jiantao Hu;  Xiaoliang Zeng;  Rong Sun;  Jian-Bin Xu;  Ching-Ping Wong
收藏  |  浏览/下载：16/0  |  提交时间：2018/02/02
Fabrication and Thermal Conduction Mechanism of Epoxy/Modified SiCNP Polymer Composites 会议论文
Harbin, China
作者:  Yun Huang;  Xiaoliang Zeng;  Rong Sun;  Jian-bin Xu;  Ching-ping Wong
收藏  |  浏览/下载：12/0  |  提交时间：2018/02/02
A Novel Organic Substrate with Enhanced Thermal Conductivity 会议论文
Orlando，the USA
作者:  Xiaoliang Zeng;  Yimin Yao;  Yougen Hu;  Kun Guo;  Jiajia Sun
收藏  |  浏览/下载：22/0  |  提交时间：2018/02/02
Multidisciplinary design optimization of air-based battery thermal management system in electric vehicles 会议论文
58th AIAA/ASCE/AHS/ASC Structures, Structural Dynamics, and Materials Conference, 2017, Grapevine, TX, United states, 2017-01-09
作者:  Li, Mao;  Wang, Xiaobang;  Liu, Yuanzhi;  Zou, Ziyan;  Cui, Mingjian
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/03
Sintering of SiC enhanced copper paste for high power applications 会议论文
2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01
作者:  Gutierrez, Marti[1];  Wang, Nan[2];  Samani, Majid Kabiri[3];  Ye, Lilei[4];  Liu, Johan[5]
收藏  |  浏览/下载：4/0  |  提交时间：2019/04/24
Fabrication and Characterization of a Carbon Fiber Solder Composite Thermal Interface Material 会议论文
2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01
作者:  Hansson, Josef[1];  Ye, Lilei[2];  Liu, Johan[3]
收藏  |  浏览/下载：3/0  |  提交时间：2019/04/24
Graphene-CNT Hybrid Material as Potential Thermal Solution in Electronics Applications 会议论文
2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01
作者:  Darmawan, Christian Chandra[1];  Ye, Lilei[2];  Samani, Majid Kabiri[3];  Fu, Yifeng[4];  Liu, Johan[5]
收藏  |  浏览/下载：16/0  |  提交时间：2019/04/24
Current status and progress of organic functionalization of CNT based thermal interface materials for electronics cooling applications 会议论文
2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01
作者:  Nylander, Andreas[1];  Fu, Yifeng[2];  Ye, Lilei[3];  Liu, Johan[4]
收藏  |  浏览/下载：27/0  |  提交时间：2019/04/24
Thermal characteristics of compact conduction-cooled high power diode laser array packages 会议论文
components and packaging for laser systems iii 2017, san francisco, ca, united states, 2017-01-31
作者:  Zhang, Pu;  Liu, Xingsheng;  Zhu, Qiwen;  Wang, Jingwei
收藏  |  浏览/下载：19/0  |  提交时间：2017/06/08
The Evaluation Methods and the Empirical Study of Energy Saving Performance for the Thermal Power Enterprises 会议论文
4TH INTERNATIONAL CONFERENCE ON ECONOMICS AND MANAGEMENT (ICEM), 2017-01-01
作者:  Liu, Ze-shuang;  Wu, Xin-ping
收藏  |  浏览/下载：14/0  |  提交时间：2019/12/20

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