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Thermal behavior of microchannel cooled high power diode laser arrays 会议论文
17th international conference on electronic packaging technology, icept 2016, wuhan, china, 2016-08-16
作者:  Wu, Dihai;  Zhang, Pu;  Nie, Zhiqiang;  Xiong, Lingling;  Song, Yunfei
收藏  |  浏览/下载:30/0  |  提交时间:2016/11/22
A CALPHAD Helmholtz Energy Approach to Assess the Thermodynamic and Thermophysical Properties of Fcc Ag 会议论文
2nd Annual International Conference on Advanced Material Engineering (AME)
作者:  Guo, Xin[1];  Xu, Zhi-Feng[2];  Lu, Xiao-Gang[3]
收藏  |  浏览/下载:4/0  |  提交时间:2019/04/26
First-principles investigation of mechanical,thermodynamic and electronic properties of FeSn_5 and CoSn_5 intermetallic phases under pressure 会议论文
作者:  Wenming Sun;  Liang Zhang;  Jing Liu;  Hong Wang;  Yuxiang Bu
收藏  |  浏览/下载:4/0  |  提交时间:2019/12/31
First-principles investigation of mechanical, thermodynamic and electronic properties of FeSn_5 and CoSn_5 phases 会议论文
第九届计算纳米科学与新能源材料国际研讨会
作者:  Wenming Sun;  Liang Zhang;  Jing Liu;  Hong Wang;  Yuxiang Bu
收藏  |  浏览/下载:3/0  |  提交时间:2019/12/31
Influence of annealing treatment on microstructure and mechanical properties of Fe-Cu-Si-Al amorphous composites 会议论文
Guiyang, China, July 10, 2015 - July 14, 2015
作者:  Zhao, Yanchun;  Ma, Wenlong;  Yuan, Xiaopeng;  Zhao, Zhi Ping;  Huang, Mingyuan
收藏  |  浏览/下载:1/0  |  提交时间:2020/11/15


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