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Thermal behavior of microchannel cooled high power diode laser arrays 会议论文
17th international conference on electronic packaging technology, icept 2016, wuhan, china, 2016-08-16
作者:  Wu, Dihai;  Zhang, Pu;  Nie, Zhiqiang;  Xiong, Lingling;  Song, Yunfei
收藏  |  浏览/下载:30/0  |  提交时间:2016/11/22
SSL VPN resources log optimization techniques based on bloom filter algorithm 会议论文
2016 IEEE Information Technology, Networking, Electronic and Automation Control Conference, ITNEC 2016, Chongqing, China, May 20, 2016 - May 22, 2016
作者:  Song, Yongchun;  Li, Hongxin;  Cheng, Lin;  Xiang, Mingming;  Cai, Jiawei
收藏  |  浏览/下载:6/0  |  提交时间:2017/01/18
Semi-blind source separation in smart home 会议论文
2016 IEEE Information Technology, Networking, Electronic and Automation Control Conference, ITNEC 2016, Chongqing, China, May 20, 2016 - May 22, 2016
作者:  Liu, Mingfei;  Li, Shouliang;  Yang, Yi;  Li, Caihong;  Li, Lian
收藏  |  浏览/下载:6/0  |  提交时间:2017/01/18
One-step fabrication of super-hydrophobic surface on thermoplastic substrates with hybrid micro/nano-scale structures 会议论文
International Conference of Microfluidics, Nanofluidics and Lab-on-a-Chip, Dalian
作者:  Hongtao Feng;  Weiliang Shu;  Baoyue Zhang;  Jingjing Wang;  Yan Chen
收藏  |  浏览/下载:26/0  |  提交时间:2017/01/15
Review on the research of online reviews' perceived credibility 会议论文
作者:  Li, Qi;  Ren, Xiaojing
收藏  |  浏览/下载:2/0  |  提交时间:2019/11/26
Subspace Clustering by Capped l(1) Norm 会议论文
7th chinese conference on pattern recognition (ccpr), chengdu, peoples r china, 2016-11-05
作者:  Lu, Quanmao;  Li, Xuelong;  Dong, Yongsheng;  Tao, Dacheng
收藏  |  浏览/下载:24/0  |  提交时间:2017/09/08
The Impact of Different Power Structures on the Cross-border E-retail Supply Chain with an O2O Dual-channel 会议论文
The Sixteenth International Conference on Electronic Business
作者:  Wang XP(王旭坪)
收藏  |  浏览/下载:7/0  |  提交时间:2019/12/09
The impact of different power structures on the cross-boder e-retail supply chain with an O2O dual- channel 会议论文
16th International Conference on Electronic Business, ICEB 2016, 2016-12-04
作者:  Sun Z.L.;  Wang X.P.;  Zhan H.X.
收藏  |  浏览/下载:2/0  |  提交时间:2019/12/09
Numerical Investigation on Atomic Migration Effect on Thermal Conductivity of Al/Cu Interface Structures in Electronic Interconnection Packaging 会议论文
7th International Symposium on Dielectrics for Nanosystems - Materials Science, Processing, Reliability and Manufacturing held as part of the 229th Meeting of The Electrochemical-Society, 2016-05-29
作者:  Zhang, L. Q.[1];  Ge, D. H.[2]
收藏  |  浏览/下载:4/0  |  提交时间:2019/12/24
Electronic structures of antisite defects in chiral (6,2) SiC nanotubes 会议论文
International Conference on Materials Applications and Engineering, ICMAE 2016, June 25, 2016 - June 26, 2016
作者:  Ma, Hu Shan;  Liu, Hong Xia;  Li, Ke Jian
收藏  |  浏览/下载:1/0  |  提交时间:2019/12/31


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