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Thermal behavior of microchannel cooled high power diode laser arrays 会议论文
17th international conference on electronic packaging technology, icept 2016, wuhan, china, 2016-08-16
作者:  Wu, Dihai;  Zhang, Pu;  Nie, Zhiqiang;  Xiong, Lingling;  Song, Yunfei
收藏  |  浏览/下载：30/0  |  提交时间：2016/11/22
Numerical simulation of thermo-mechanical behavior in high power diode laser arrays 会议论文
17th international conference on electronic packaging technology, icept 2016, wuhan, china, 2016-08-16
作者:  Lu, Yao;  Nie, Zhiqiang;  Zhang, Pu;  Wang, Zhenfu;  Xiong, Lingling
收藏  |  浏览/下载：39/0  |  提交时间：2016/11/22
Modeling of evolution process of edge over erosion in copper CMP using frequency components algorithm 会议论文
Shanghai, China, March 13, 2016 - March 14, 2016
作者:  Wu, Lixiao;  Hahn, Sookap;  Yan, Changfeng
收藏  |  浏览/下载：2/0  |  提交时间：2020/11/15
Copper chaperons as novel targets for therapy in triple-negative breast cancer (TNBC) 会议论文
作者:  Karginova, O.;  Song, A.;  Wang, J.;  Luo, C.;  Jiang, H.
收藏  |  浏览/下载：9/0  |  提交时间：2019/01/08
Fabrication and Characterization of Low Stress Si Interposer with Air-gapped Si Interconnection for Hermetical System-in-Package 会议论文
2016 IEEE 66TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), Las Vegas, NV
作者:  Luo, Rongfeng;  Ren, Kuili;  Ma, Shenglin;  Yan, Jun;  Xia, Yanming
收藏  |  浏览/下载：42/0  |  提交时间：2017/01/15
Oxidation Resistant core-shell Cu@SiO2 Nanowires for Composites with High Dielectric Performance 会议论文
The 17th International Conference on electronic packing Technology (ICEPT 2016), Changsha,China
作者:  Yanbin Shen;  Chengliang Li;  Suibin Luo;  Shuhui Yu;  Rong Sun
收藏  |  浏览/下载：14/0  |  提交时间：2017/01/15
Fabrication of Flexible conductive composites based on copper nanowires 会议论文
China Semiconductor Technology International Conference 2016, CSTIC 2016, Shanghai, China
作者:  Yu Zhu;  Yougen Hu;  Pengli Zhu;  Tao Zhao;  Xianwen Liang
收藏  |  浏览/下载：19/0  |  提交时间：2017/01/15
Electroplating Fabrication and Characterization of Sn-Ag Eutectic Solder Films 会议论文
The 17th International Conference on electronic packing Technology (ICEPT 2016), Changsha,China
作者:  Jinqi Xie;  Zhe Zhong;  Kai Zhang;  Matthew M.F. Yuen;  S.W. Ricky Lee
收藏  |  浏览/下载：21/0  |  提交时间：2017/01/15
FORMATION OF COPPER@SILVER CORE-SHELL NANOPARTICLES WITH EXCELLENT ANTIOXIDATION FOR INK-JET PRINTING 会议论文
China Semiconductor Technology International Conference 2016, CSTIC 2016, Shanghai, China
作者:  Qionglin Ouyang;  Gang Li;  Yu Zhang;  PengliZhu;  Qian Guo
收藏  |  浏览/下载：14/0  |  提交时间：2017/01/15
Epitaxial growth of copper film by MOCVD 会议论文
6th Annual Meeting on Testing and Evaluation of Advanced Materials, TEIM 2015, Chengdu, China, April 23, 2015 - April 25, 2015
作者:  Tu, Rong;  Huang, Jin;  Zhang, Song;  Zhang, Lianmeng
收藏  |  浏览/下载：1/0  |  提交时间：2019/12/04

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