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会议论文 [17]
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2016 [17]
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semiconduc... [3]
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发表日期:2016
内容类型:会议论文
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Thermally accelerated ageing test of 808nm high power diode laser arrays in CW mode
会议论文
17th international conference on electronic packaging technology, icept 2016, wuhan, china, 2016-08-16
作者:
Nie, Zhiqiang
;
Wu, Di
;
Lu, Yao
;
Wu, Dhai
;
Wang, Shuna
收藏
  |  
浏览/下载:85/0
  |  
提交时间:2016/11/22
Chip scale packages
Defects
Degradation
Electronics packaging
High power lasers
Laser beam welding
Power semiconductor diodes
Reliability
Reliability analysis
Semiconductor diodes
A compact QCW conduction-cooled high power semiconductor laser array
会议论文
17th international conference on electronic packaging technology, icept 2016, wuhan, china, 2016-08-16
作者:
Zhu, Qiwen
;
Zhang, Pu
;
Wang, Shuna
;
Wu, Dihai
;
Nie, Zhiqiang
收藏
  |  
浏览/下载:26/0
  |  
提交时间:2016/11/22
Chip scale packages
Electronics packaging
Finite element method
High power lasers
High temperature applications
Temperature
Thermal behavior of microchannel cooled high power diode laser arrays
会议论文
17th international conference on electronic packaging technology, icept 2016, wuhan, china, 2016-08-16
作者:
Wu, Dihai
;
Zhang, Pu
;
Nie, Zhiqiang
;
Xiong, Lingling
;
Song, Yunfei
收藏
  |  
浏览/下载:30/0
  |  
提交时间:2016/11/22
Computational fluid dynamics
Copper
Crosstalk
Diodes
Electronics packaging
Finite element method
Flow of water
Heat resistance
Heat sinks
Hydraulics
Laser beam welding
Microchannels
Numerical methods
Optical properties
Power semiconductor diodes
Reliability
Thermodynamic properties
Numerical simulation of thermo-mechanical behavior in high power diode laser arrays
会议论文
17th international conference on electronic packaging technology, icept 2016, wuhan, china, 2016-08-16
作者:
Lu, Yao
;
Nie, Zhiqiang
;
Zhang, Pu
;
Wang, Zhenfu
;
Xiong, Lingling
收藏
  |  
浏览/下载:40/0
  |  
提交时间:2016/11/22
Computer simulation
Electronics packaging
High power lasers
Numerical models
Occupational risks
Optical properties
Packaging
Power semiconductor diodes
Shear stress
Thermal stress
THEORETICAL AND DSMC STUDY ON HEAT CONDUCTION OF GAS IN NANOSCALE PORES
会议论文
作者:
Zhu, Chuan-Yong
;
Li, Zeng-Yao
收藏
  |  
浏览/下载:4/0
  |  
提交时间:2019/12/02
Investigating the Influence of Temperature and DC Electric Field on the Electric Conduction of Oil Impregnated Paper Insulation
会议论文
作者:
Bo, Ma
;
Min, Daomin
;
Ru, Jiasheng
;
Pan, Shaoming
;
Yin, Huang
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2019/12/02
Activation energy
high-field conduction
Oil impregnated paper
Hopping conduction
Diamond based field-effect transistors with SiNX and ZrO2 double dielectric layers
会议论文
作者:
Wang, W.
;
Fu, K.
;
Hu, C.
;
Li, F. N.
;
Liu, Z. C.
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2019/12/02
Field-effect transistor
Conduction channel
Double dielectric layer
SiNX/ZrO2
Measurement and Analysis of the Conduction Current of the Oil-paper Insulation under High DC Electric Field
会议论文
作者:
Zhou, Jerui
;
Ren, Ming
;
Dong, Ming
;
Zhang, Chongxing
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  |  
浏览/下载:7/0
  |  
提交时间:2019/11/26
oil paper insulation
conduction mechanism
high field conduction
Analysis of the 3ω method for the measurement of fluid thermal properties
会议论文
作者:
Huang, Xiangxiang
;
Hebibul, Rahman
;
Zhao, Libo
;
Xu, Tingzhong
;
Zhao, Yulong
收藏
  |  
浏览/下载:6/0
  |  
提交时间:2019/11/26
Approximate solution
Dielectric layer
Dimensionless heating
Heat conduction models
Measurement frequency
Numerical results
Ratio of length to widths
Three-dimensional model
Simulation on temperature field of friction stir welding of 2a14 aluminum alloy based on equivalent film method
会议论文
International Conference on Material Science and Engineering, ICMSE 2016, Guangzhou, China, June 24-26, 2016
作者:
Zhu Z(朱智)
;
Wang M(王敏)
;
Zhang HJ(张会杰)
;
Zhang X(张骁)
;
Yu T(于涛)
收藏
  |  
浏览/下载:20/0
  |  
提交时间:2017/02/05
2A14 Aluminum Alloy
Backing Plate
Contact Heat Transfer
Friction Stir Welding
Numerical Simulation
Temperature Field
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