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CORC

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Properties of ion track in polystyrene irradiated with high energy Fe-56 ions 会议论文
作者:  Ma, Mingwang;  Wu, Shengwei;  Lin, Jun;  Sun, Youmei;  Jin, Yunfan
收藏  |  浏览/下载：14/0  |  提交时间：2018/08/20
Carbon Nanotubes Based Composites with High Dielectric Constant and Low Loss 会议论文
Electronic Materials and Packaging (EMAP), 2012 14th International Conference on, 香港
作者:  Imtiaz Madni;  Shuhui Yu;  Rong Sun
收藏  |  浏览/下载：11/0  |  提交时间：2015/08/25
Effects of Oxygen Partial Pressure on the Sputtered Hafnium Oxide Thin Films for Resistive Random-Access Memory 会议论文
作者:  Xie, Zhongliang;  Lai, Yunfeng
收藏  |  浏览/下载：1/0  |  提交时间：2019/11/21
High energy heavy ion bombardment in polycrystalline Fe3O4 thin film 会议论文
作者:  Crothers, DSF;  McCann, JF;  VanDerHart, HW;  Williams, ID;  Shen, Tielong
收藏  |  浏览/下载：12/0  |  提交时间：2018/08/20
Survey on disposal behaviour and awareness of mobile phones in Chinese university students 会议论文
7th International Conference on Waste Management and Technology (ICWMT), Beijing, PEOPLES R CHINA, SEP 05-07, 2012
作者:  Li, Bo;  Yang, Jianxin;  Song, Xiaolong;  Lu, Bin
收藏  |  浏览/下载：18/0  |  提交时间：2015/12/24
Effects of Ti on electronic structure and mechanical property of uranium: A first-principles study 会议论文
141st Annual Meeting and Exhibition, TMS 2012, 2012-03-11
作者:  Qi, Jianbo[1];  Ren, Yonggang[2];  Wu, Guangxin[3];  Zhang, Jieyu[4];  Chou, Kuochih[5]
收藏  |  浏览/下载：4/0  |  提交时间：2019/04/30
Effects of Annealing Treatment on Optical and Electronic Properties of GaN Based LEDs with ITO Films 会议论文
CHINA SEMICONDUCTOR TECHNOLOGY INTERNATIONAL CONFERENCE 2012 (CSTIC 2012), 2012-03-18
作者:  Wang, W. J.[1];  Li, X. F.[2];  Zhang, J. S.[3];  Zhang, J. H.[4]
收藏  |  浏览/下载：1/0  |  提交时间：2019/04/30
Effects of angular spread on the performance in TD-SCDMA system with smart antenna 会议论文
Shenyang, China, July 27, 2012 - July 29, 2012
作者:  Shi, Penglong;  Ma, Xiaoting;  Chu, Yaru;  Ma, Yizhong;  Shi, P.
收藏  |  浏览/下载：1/0  |  提交时间：2017/01/17
Effects of Cooling Rate and Solder Volume on the Formation of Large Ag3Sn Plates in Sn-Ag Based Solder Joints 会议论文
13th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), Guilin, PEOPLES R CHINA, 2012-01-01
作者:  Zhou, Qiang;  Huang, Mingliang;  Zhao, Ning;  Zhang, Zhijie
收藏  |  浏览/下载：1/0  |  提交时间：2019/12/13

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