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浏览/检索结果: 共41条，第1-10条 帮助 限定条件 发表日期：2009    专题：大连理工大学    第一署名单位    第一作者单位    通讯作者单位     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Synthesis of high-silicon beta zeolite comprises mixing ethanol solvent, tetraethylammonium hydroxide template agent solution, white carbon black, aluminum hydroxide dry gel and solid ammonium fluoride and hydrothermally crystallizing. 专利 申请日期: 2009-01-01, 公开日期: 2009-06-24 作者:  GUO H XIE H ZHENG B 收藏  |  浏览/下载：3/0  |  提交时间：2019/12/24 Characteristics of the wheel surface topography in ultra-precision grinding of silicon wafers 期刊论文 Key Engineering Materials, 2009, 卷号: 389-390, 页码: 36-41 作者:  Huo F.W.;  Guo D.M.;  Kang R.K.;  Jin Z.J. 收藏  |  浏览/下载：1/0  |  提交时间：2019/12/24 Visible light photocatalytic material for purifying air, is obtained by dispersing photocatalyst powder containing copper oxide and bismuth vanadate using silicon-titanium sol, supporting on nylon base material, drying and baking. 专利 申请日期: 2009-01-01, 公开日期: 2009-04-08 作者:  LIU L SUO J YANG F 收藏  |  浏览/下载：3/0  |  提交时间：2019/12/24 Automatic detonation and ignition retardation fire arrestor for use in chemical engineering machinery, has light-sensitive element connected to one end of silicon photodiode whose another end is connected with single chip. 专利 申请日期: 2009-01-01, 公开日期: 2009-09-16 作者:  YUAN X YU J ZHAO T 收藏  |  浏览/下载：2/0  |  提交时间：2019/12/24 Manufacturing method of piezoelectric micro-cantilever probe for e.g. atomic force microscope, involves photo-etching silicon cup for forming silicon needle and piezoelectric sensitive layer, and providing layer on micro-cantilever. 专利 申请日期: 2009-01-01, 公开日期: 2009-11-18 作者:  CUI Y WANG L XIA J ZHANG L ZHAO J 收藏  |  浏览/下载：4/0  |  提交时间：2019/12/24 Design and simulation of blue/violet sensitive photodetectors in silicon-on-insulator 期刊论文 Journal of Semiconductors, 2009, 卷号: 30, 页码: 59-62 作者:  Han Zhitao;  Chu Jinkui;  Meng Fantao;  Jin Rencheng 收藏  |  浏览/下载：1/0  |  提交时间：2019/12/24 Optimization of the acid leaching process by using an ultrasonic field for metallurgical grade silicon 期刊论文 Journal of Semiconductors, 2009, 卷号: 30, 页码: - 作者:  Zhang J.;  Li T.;  Ma X.;  Luo D.;  Liu N. 收藏  |  浏览/下载：1/0  |  提交时间：2019/12/24 NANOTOPOGRAPHY IN SILICON WAFER MANUFACTURING: A LITERATURE REVIEW 会议论文 ASME International Manufacturing Science and Engineering Conference, West Lafayette, IN, 2009-10-04 作者:  Qin, Na;  Pei, Z. J.;  Guo, D. M. 收藏  |  浏览/下载：2/0  |  提交时间：2019/12/24 Machining  Measurement  Nanotopography  Silicon Wafer  Simultaneous Double Side Grinding   Study on subsurface damage model of the ground monocrystallinge silicon wafers 期刊论文 Key Engineering Materials, 2009, 卷号: 416, 页码: 66-70 作者:  Zhang, Y.;  Su, J.;  Gao, W.;  Kang, R. 收藏  |  浏览/下载：1/0  |  提交时间：2019/12/24 Silicon wafer  Grinding  Subsurface damage model   Study on grinding performance of soft abrasive wheel for silicon wafer 期刊论文 Key Engineering Materials, 2009, 卷号: 416, 页码: 529-534 作者:  Kang, R.;  Gao, S.;  Jin, Z.;  Guo, D. 收藏  |  浏览/下载：2/0  |  提交时间：2019/12/24 Silicon wafer  Grinding  Soft abrasive wheel  Subsurface damage