Photocarrier Radiometry Characterization of Ultra-shallow Junctions (USJ) in Silicon with Excimer Laser Irradiation
Wang, Qian1,2; Li, Bincheng1; Ren, Shengdong1,2; Wang, Qiang1
刊名INTERNATIONAL JOURNAL OF THERMOPHYSICS
2015-06-01
卷号36期号:5-6页码:1173-1180
关键词Ion implantation Laser irradiation Photocarrier radiometry Silicon Ultra-shallow junction
英文摘要The activation and recrystallization in arsenic ion-implanted silicon under excimer laser (193 nm) irradiation is investigated using photocarrier radiometry (PCR). Arsenic ion-implanted silicon wafers with a dose of and an energy of 1 keV were irradiated at different laser parameters, such as the laser fluence, shot number, and repetition rate. The excimer laser irradiation-induced enhancement of PCR signals of implanted silicon samples showed that the implantation-induced crystalline structural damage was reduced and the implanted ions were effectively activated.
WOS标题词Science & Technology ; Physical Sciences ; Technology
类目[WOS]Thermodynamics ; Chemistry, Physical ; Mechanics ; Physics, Applied
研究领域[WOS]Thermodynamics ; Chemistry ; Mechanics ; Physics
关键词[WOS]BORON
收录类别SCI
语种英语
WOS记录号WOS:000356611100050
公开日期2015-12-24
内容类型期刊论文
源URL[http://ir.ioe.ac.cn/handle/181551/3663]  
专题光电技术研究所_光电技术研究所被WoS收录文章
作者单位1.Chinese Acad Sci, Inst Opt & Elect, Chengdu 610209, Sichuan, Peoples R China
2.Univ Chinese Acad Sci, Beijing 100039, Peoples R China
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Wang, Qian,Li, Bincheng,Ren, Shengdong,et al. Photocarrier Radiometry Characterization of Ultra-shallow Junctions (USJ) in Silicon with Excimer Laser Irradiation[J]. INTERNATIONAL JOURNAL OF THERMOPHYSICS,2015,36(5-6):1173-1180.
APA Wang, Qian,Li, Bincheng,Ren, Shengdong,&Wang, Qiang.(2015).Photocarrier Radiometry Characterization of Ultra-shallow Junctions (USJ) in Silicon with Excimer Laser Irradiation.INTERNATIONAL JOURNAL OF THERMOPHYSICS,36(5-6),1173-1180.
MLA Wang, Qian,et al."Photocarrier Radiometry Characterization of Ultra-shallow Junctions (USJ) in Silicon with Excimer Laser Irradiation".INTERNATIONAL JOURNAL OF THERMOPHYSICS 36.5-6(2015):1173-1180.
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