A Wafer-Level Sn-Rich Au-Sn Bonding Technique and Its Application in Surface Plasmon Resonance Sensors

	A Wafer-Level Sn-Rich Au-Sn Bonding Technique and Its Application in Surface Plasmon Resonance Sensors
	Mao, X ; Lv, XD ; Wei, WW ; Zhang, Z ; Yang, JL ; Qi, ZM ; Yang, FH
刊名	chinese physics letters
	2014
卷号	31 期号:5 页码:056803
学科主题	微电子学
收录类别	SCI
语种	英语
公开日期	2015-04-02
内容类型	期刊论文
源URL	[http://ir.semi.ac.cn/handle/172111/26315]
专题	半导体研究所_半导体集成技术工程研究中心
推荐引用方式 GB/T 7714	Mao, X,Lv, XD,Wei, WW,et al. A Wafer-Level Sn-Rich Au-Sn Bonding Technique and Its Application in Surface Plasmon Resonance Sensors[J]. chinese physics letters,2014,31(5):056803.
APA	Mao, X.,Lv, XD.,Wei, WW.,Zhang, Z.,Yang, JL.,...&Yang, FH.(2014).A Wafer-Level Sn-Rich Au-Sn Bonding Technique and Its Application in Surface Plasmon Resonance Sensors.chinese physics letters,31(5),056803.
MLA	Mao, X,et al."A Wafer-Level Sn-Rich Au-Sn Bonding Technique and Its Application in Surface Plasmon Resonance Sensors".chinese physics letters 31.5(2014):056803.